Superconducting bump bonds
US-11133451-B2 · Sep 28, 2021 · US
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Patent family 55229849
This patent family groups 6 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55229849 |
| Family type | — |
| Earliest priority | Dec 15, 2015 |
| First filing country | US |
| Member publications | 6 |
| Countries | US |
| Representative publication | US11133451B2 — Superconducting bump bonds |
Representative publication
Best representative member for this family based on priority and filing country.
US11133451B2 — Superconducting bump bonds (published Sep 28, 2021)
Member publications
Related publications in this family.
Superconducting bump bonds
US-11133450-B2 · Sep 28, 2021 · US
Superconducting bump bonds
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Superconducting bump bonds
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Superconducting bump bonds
US-10497853-B2 · Dec 3, 2019 · US
Superconducting bump bonds
US-2018366634-A1 · Dec 20, 2018 · US