Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
US-10446469-B2 · Oct 15, 2019 · US
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Patent family 48464820
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 48464820 |
| Family type | — |
| Earliest priority | Dec 9, 2011 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10446469B2 — Semiconductor device having a copper element and method of forming a semiconductor device having a copper element |
Representative publication
Best representative member for this family based on priority and filing country.
US10446469B2 — Semiconductor device having a copper element and method of forming a semiconductor device having a copper element (published Oct 15, 2019)
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