Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Patent metadata

Field	Value
Publication number	US-9355997-B2
Application number	US-201414288064-A
Country	US
Kind code	B2
Filing date	May 27, 2014
Priority date	Mar 12, 2014
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

An assembly with modules ( 110, 1310 ) containing integrated circuits and attached to a wiring substrate ( 120 ) is reinforced by one or more reinforcement frames ( 410 ) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414 ) in the reinforcement frame. Other features are also provided.

First claim

The invention claimed is:

1. An assembly comprising:
a first substrate comprising a plurality of first contact pads;
a plurality of modules attached to the first substrate, at least one said module comprising a semiconductor integrated circuit, the module comprising one or more contact pads each of which is attached to a respective first contact pad;
a reinforcement frame comprising one or more cavities, the reinforcement frame being attached to the first substrate, wherein at least part of each said module is located in a corresponding cavity in the reinforcement frame, wherein at least two said modules have different heights and are at least partially located in the same cavity in the reinforcement frame;
wherein the reinforcement frame comprises a through-hole; and
the assembly further comprises one or more heat sinks each of which overlies the through-hole, wherein at least one said heat sink overlying the through-hole is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than the reinforcement frame.

2. An assembly comprising:
a first substrate comprising a first side and one or more first contact pads at the first side;
one or more modules attached to the first substrate, each said module comprising a semiconductor integrated circuit, each said module comprising one or more contact pads each of which is attached to a respective first contact pad; and
one or more reinforcement frames attached to the first substrate, each said reinforcement frame comprising one or more openings, at least part of each said module being located in a corresponding opening in a corresponding reinforcement frame;
wherein in at least one said reinforcement frame, at least one said opening comprises a through-hole; and
the assembly further comprises one or more heat sinks each of which overlies one or more of said through-holes in one or more of said reinforcement frames, wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than each said reinforcement frame.

3. The assembly of claim 2 wherein the assembly comprises one or more test pads for testing the assembly which are accessible through at least one said through-hole and are laterally surrounded by the corresponding reinforcement frame.

4. The assembly of claim 3 wherein at least one said test pad is part of the first substrate.

5. The assembly of claim 3 wherein at least one said test pad is part of a module at least partially located in the at least one opening.

6. The assembly of claim 2 wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame.

7. The assembly of claim 2 wherein at least one said heat sink overlying at least one said through-hole is attached to at least one said module at least partially located in the through-hole.

8. The assembly of claim 2 wherein the first substrate comprises a first alignment feature, and at least one said reinforcement frame comprises a second alignment feature, and one of the first and second alignment features is a recess, and the other one of the first and second alignment features is a protrusion having no electrical functionality and at least partially located in the recess.

9. The assembly of claim 2 wherein the one or more reinforcement frames are directly bonded to the first substrate.

10. The assembly of claim 2 wherein the one or more reinforcement frames are a plurality of reinforcement frames.

11. The assembly of claim 2 wherein at least one said through-hole is cylindrical.

12. The assembly of claim 10 wherein the reinforcement frames are spaced from each other.

13. The assembly of claim 10 wherein the first substrate comprises one or more test pads for testing the assembly which are located outside of the reinforcement frames.

14. The assembly of claim 13 wherein at least one said test pad is located between at least two said reinforcement frames.

15. A method for manufacturing an assembly, the method comprising:
obtaining a first substrate comprising a first side and one or more first contact pads at the first side;
obtaining one or more modules attached to the first substrate, each said module comprising a semiconductor integrated circuit, each said module comprising one or more contact pads each of which is attached to a respective first contact pad; and
attaching one or more reinforcement frames to the first substrate, each said reinforcement frame comprising one or more openings, at least part of each said module being located in a corresponding opening in a corresponding reinforcement;
wherein in at least one said reinforcement frame, at least one said opening comprises a through-hole; and
the method further comprises attaching one or more heat sinks over one or more of said through-holes in one or more of said reinforcement frames, wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than each said reinforcement frame.

16. The method of claim 15 wherein the one or more reinforcement frames are a plurality of reinforcement frames which are spaced from each other.

17. The method of claim 15 wherein the one or more reinforcement frames are a plurality of reinforcement frames, and the method further comprises dicing the first substrate between at least two said reinforcement frames to form a plurality of dies, each said reinforcement frame being in one of the dies.

18. The method of claim 15 wherein the first substrate comprises one or more test pads for testing the assembly which are located outside of the one or more reinforcement frames.

19. The method of claim 18 wherein at least one said test pad is located between at least two said reinforcement frames.

20. The method of claim 15 wherein attaching the one or more reinforcement frames to the first substrate comprises directly bonding the one or more reinforcement frames to the first substrate.

21. The method of claim 15 wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame.

22. The method of claim 15 wherein at least one said heat sink overlying at least one said through-hole is attached to at least one said module at least partially located in the through-hole.

Assignees

• Invensas Corp

Inventors

• Katkar Rajesh
• Mirkarimi Laura Wills
• Sitaram Arkalgud
• Woychik Charles G

Classifications

• H10D62/117

  Shapes of semiconductor bodies · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W76/18

  Insulating materials, e.g. resins, glasses or ceramics · CPC title

• H10W76/17

  characterised by their materials · CPC title