Package structure
US-2021375724-A1 · Dec 2, 2021 · US
Alignment aids, e.g. alignment marks
Alignment aids, e.g. alignment marks · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/985 |
| Official title | {Alignment aids, e.g. alignment marks} |
| Display label | Alignment aids, e.g. alignment marks |
| Total patents | 164 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 4 |
| 2017 | 11 |
| 2018 | 9 |
| 2019 | 7 |
| 2020 | 11 |
| 2021 | 21 |
| 2022 | 21 |
| 2023 | 29 |
| 2024 | 23 |
| 2025 | 19 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device
US-2021305198-A1 · Sep 30, 2021 · US
Semiconductor structure
US-2021257340-A1 · Aug 19, 2021 · US
Semiconductor device having alignment pads and method of manufacturing the same
US-2021242148-A1 · Aug 5, 2021 · US
Semiconductor wafer, bonding structure and wafer bonding method
US-11069647-B2 · Jul 20, 2021 · US
Integrated circuit component and package structure having the same
US-2021210395-A1 · Jul 8, 2021 · US
3D semiconductor device and structure
US-11056468-B1 · Jul 6, 2021 · US
3d semiconductor device and structure
US-2021193626-A1 · Jun 24, 2021 · US
Semiconductor device with edge-protecting spacers over bonding pad
US-2021143114-A1 · May 13, 2021 · US
Method of fabricating semiconductor structure
US-10998293-B2 · May 4, 2021 · US
Package-on-package (pop) type semiconductor packages
US-2021074691-A1 · Mar 11, 2021 · US
Alignment apparatus and method of manufacturing semiconductor device
US-2021043488-A1 · Feb 11, 2021 · US
Method for manufacturing an electronic circuit component and electronic circuit component
US-2021035943-A1 · Feb 4, 2021 · US
3d semiconductor device and structure
US-2020411459-A1 · Dec 31, 2020 · US
Method of fabricating semiconductor structure
US-2020395339-A1 · Dec 17, 2020 · US
Method of self-assembly with a hybrid molecular bonding
US-2020365540-A1 · Nov 19, 2020 · US
Semiconductor Wafer, Bonding Structure And Wafer Bonding Method
US-2020335473-A1 · Oct 22, 2020 · US
Maintaining alignment between a LED device and a backplane during bonding
US-10811401-B1 · Oct 20, 2020 · US
Display device
US-2020321401-A1 · Oct 8, 2020 · US
Manufacturing method and manufacturing apparatus for stacked substrate, and program
US-2020273836-A1 · Aug 27, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/985?
- CPC H10W72/985 is the Cooperative Patent Classification code for “Alignment aids, e.g. alignment marks.”
- How many patents are filed under CPC H10W72/985 (Alignment aids, e.g. alignment marks)?
- Our database includes 164 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/985 growing?
- Publication counts under this code: 23 in 2024 vs 19 in 2025 (latest complete years).