Semiconductor device
US-2020402946-A1 · Dec 24, 2020 · US
being orthogonal to a side surface of the chip, e.g. in parallel arrangements
being orthogonal to a side surface of the chip, e.g. in parallel arrangements · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/642 |
| Official title | {being orthogonal to a side surface of the chip, e.g. in parallel arrangements} |
| Display label | being orthogonal to a side surface of the chip, e.g. in parallel arrangements |
| Total patents | 133 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 9 |
| 2017 | 7 |
| 2018 | 8 |
| 2019 | 8 |
| 2020 | 24 |
| 2021 | 22 |
| 2022 | 13 |
| 2023 | 13 |
| 2024 | 10 |
| 2025 | 9 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device
US-2020395276-A1 · Dec 17, 2020 · US
Semiconductor device and method of manufacturing semiconductor device
US-2020395284-A1 · Dec 17, 2020 · US
Semiconductor Package with Space Efficient Lead and Die Pad Design
US-2020373228-A1 · Nov 26, 2020 · US
Semiconductor device and fabrication method of the semiconductor device
US-2020343208-A1 · Oct 29, 2020 · US
Quad Package with Conductive Clips Connected to Terminals at Upper Surface of Semiconductor Die
US-2020328140-A1 · Oct 15, 2020 · US
Semiconductor device and fabrication method of the semiconductor device
US-10790247-B2 · Sep 29, 2020 · US
Semiconductor device and method of manufacturing the same
US-10777490-B2 · Sep 15, 2020 · US
Semiconductor module
US-10770400-B2 · Sep 8, 2020 · US
Semiconductor module and semiconductor module manufacturing method
US-2020266129-A1 · Aug 20, 2020 · US
Electronic device flip chip package with exposed clip
US-2020235067-A1 · Jul 23, 2020 · US
Method for manufacturing semiconductor device
US-2020227279-A1 · Jul 16, 2020 · US
Semiconductor device and method of manufacturing semiconductor device
US-2020227280-A1 · Jul 16, 2020 · US
Semiconductor device and method for producing semiconductor device
US-2020211937-A1 · Jul 2, 2020 · US
Methods of fabricating high voltage semiconductor devices having improved electric field suppression
US-2020194388-A1 · Jun 18, 2020 · US
Semiconductor package structure
US-10672677-B2 · Jun 2, 2020 · US
Stack of electrical components and method of producing the same
US-2020118963-A1 · Apr 16, 2020 · US
Semiconductor device and method for producing semiconductor device
US-10622288-B2 · Apr 14, 2020 · US
Multi-Clip Structure for Die Bonding
US-2020105707-A1 · Apr 2, 2020 · US
Multi-phase power converter with common connections
US-10573631-B2 · Feb 25, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/642?
- CPC H10W72/642 is the Cooperative Patent Classification code for “being orthogonal to a side surface of the chip, e.g. in parallel arrangements.”
- How many patents are filed under CPC H10W72/642 (being orthogonal to a side surface of the chip, e.g. in parallel arrangements)?
- Our database includes 133 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/642 growing?
- Publication counts under this code: 10 in 2024 vs 9 in 2025 (latest complete years).