Semiconductor device and method for producing semiconductor device

Patent metadata

Field	Value
Publication number	US-10622288-B2
Application number	US-201816178265-A
Country	US
Kind code	B2
Filing date	Nov 1, 2018
Priority date	Nov 6, 2017
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

A semiconductor device includes a semiconductor element, leads, and an encapsulation resin covering a portion of each of the leads and the semiconductor element. Each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin. The external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin. The external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends. The two recesses extend from a distal surface toward the encapsulation resin. The opposite ends in the width-wise direction define an end connection part. The external connection portion includes a part between the two recesses defining a center connection part.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a semiconductor element;
leads; and
an encapsulation resin covering a portion of each of the leads and the semiconductor element, wherein
each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin,
the external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin,
the external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends,
the two recesses extend from a distal surface of the external connection portion toward the encapsulation resin,
the opposite ends in the width-wise direction define an end connection part,
the external connection portion includes a part between the two recesses defining a center connection part, and
an entire portion of each of the recesses is exposed from the encapsulation resin.

2. The semiconductor device according to claim 1 , wherein at least a portion of an end surface of the end connection part is free of a plating layer.

3. The semiconductor device according to claim 1 , wherein the end connection part projects more than an end surface of the center connection part.

4. The semiconductor device according to claim 1 , wherein
each of the recesses has a depth from the distal surface to a bottom in a direction from the distal surface of the external connection portion toward the encapsulation resin, and
the depth of each of the recesses is shorter than a length of the external connection portion from the distal surface of the external connection portion to the encapsulation resin.

5. A semiconductor device, comprising:
a semiconductor element;
leads; and
an encapsulation resin covering a portion of each of the leads and the semiconductor element, wherein
each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin,
the external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin,
the external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends,
the two recesses extend from a distal surface of the external connection portion toward the encapsulation resin,
the opposite ends in the width-wise direction define an end connection part,
the external connection portion includes a part between the two recesses defining a center connection part, and
the semiconductor device further comprises a plating layer covering a wall surface of the recesses and an end surface of the center connection part.

6. A method for producing a semiconductor device that encapsulates a semiconductor element and a portion of each of leads with a resin, the method comprising steps of:
preparing a lead frame that form the leads;
forming an encapsulation resin covering a portion of each of the leads and a semiconductor element mounted on the lead frame; and
forming an external connection portion that projects from a side surface of the encapsulation resin by cutting the leads, wherein
the leads are connected to a frame portion of the lead frame by a frame connector that forms the external connection portion,
the frame connector includes a first through hole extending in a width-wise direction and second through holes extending from opposite ends of the first through hole away from the frame portion, and
in the forming an external connection portion, the frame connector is cut across the first through hole so that the external connection portion is formed to have opposite ends in a width-wise direction that extends along a side surface of the encapsulation resin and include two recesses, the two recesses being arranged toward a center in the width-wise direction from the opposite ends and extending from a distal surface of the external connection portion toward the encapsulation resin, the opposite ends of the external connection portion in the width-wise direction define an end connection part, and the external connection portion includes a part between the two recesses defining a center connection part.

7. The method according to claim 6 , wherein a plating layer is formed on a surface of the lead frame including the first through hole and the second through holes.

8. The method according to claim 6 , wherein in the forming an external connection portion, the external connection portion is cut so that the end connection part projects more than an end surface of the center connection part.

9. A semiconductor device, comprising:
a first lead including a die pad and an external connection portion;
a second lead including an internal connection portion and an external connection portion;
a semiconductor element mounted on the die pad; and
a connection plate electrically connecting the semiconductor element and the second lead, wherein
the connection plate includes an element connector connected to the semiconductor element, a lead connector connected to the second lead, and a joint joining the element connector and the lead connector,
the second lead includes a restriction portion connected to the lead connector and including restriction surfaces, and
the restriction portion restricts movement of the connection plate with the restriction surfaces.

10. The semiconductor device according to claim 9 , wherein the restriction surfaces include a first restriction surface opposed to the lead connector and a second restriction surface opposed to the lead connector and orthogonal to the first restriction surface.

11. The semiconductor device according to claim 10 , wherein the first restriction surface faces toward the die pad.

12. The semiconductor device according to claim 10 , wherein the second restriction surface is one of two second restriction surfaces opposed to each other, and
the restriction portion includes the two second restriction surfaces.

13. The semiconductor device according to claim 9 , wherein the restriction portion is a connection recess arranged in an upper surface of the second lead.

14. The semiconductor device according to claim 13 , wherein the connection recess is open toward the first lead.

15. The semiconductor device according to claim 9 , further comprising an encapsulation resin covering the die pad, the internal connection portion, the semiconductor element, and the connection plate.

16. The semiconductor device according to claim 15 , wherein the first lead and the second lead are exposed from a lower surface of the encapsulation resin.

17. The semiconductor device according to claim 15 , wherein
the second lead is one of second leads, and
the second leads are arranged along a side surface of the encapsulation resin.

18. The semiconductor device according to claim 9 , wherein
a semiconductor element is mounted on the die pad,
the die pad is tetragonal,
the second lead is one of two second leads,
the two second leads are arranged along a side of the die pad opposite to a side of the external connection portion,
the lead connector is one of two lead connectors,
the connection plate includes the element connector connected to the semiconductor element and the two lead connectors respectively connected to the two second leads, and
the joint joins the element connector and the two lead connectors.

19. The semiconductor device according to claim 9 , wherein
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Assignees

• Rohm Co Ltd

Inventors

• Saito Koshun

Classifications

• H01L2224/37611

  Electricity · mapped topic

• H01L24/32

  Electricity · mapped topic

• H01L23/49562 Primary

  Electricity · mapped topic

• H01L2224/32245

  Electricity · mapped topic

• H01L24/73

  Electricity · mapped topic