Die stack arrangement comprising a die-attach-film tape and method for producing same

Patent metadata

Field	Value
Publication number	US-10861818-B2
Application number	US-201916366490-A
Country	US
Kind code	B2
Filing date	Mar 27, 2019
Priority date	Mar 28, 2018
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A device includes a base substrate with a sensor component arranged thereon; a spacer layer on the base substrate, wherein the spacer layer is structured in order to predefine a cavity region, in which the sensor component is arranged in an exposed fashion on the base substrate, and a DAF tape element (DAF=Die-Attach-Film) on a stack element, wherein the DAF tape element mechanically fixedly connects the stack element to the spacer layer arranged on the base substrate and to obtain the cavity region.

First claim

What is claimed is:

1. A device comprising:
a base substrate with a sensor component arranged thereon;
a spacer layer on the base substrate, wherein the spacer layer is structured in order to predefine a cavity region, in which the sensor component is arranged in an exposed fashion on the base substrate; and
a DAF tape element (DAF=Die-Attach-Film) on a stack element, wherein the DAF tape element is configured mechanically fixedly to connect the stack element to the spacer layer arranged on the base substrate and to obtain the cavity region, and wherein the DAF tape element is arranged only in a region between a first boundary on or above a top surface of the spacer layer and a second boundary on or below a bottom surface of the stack element in a pre-cured state.

2. The device as claimed in claim 1 , wherein the spacer layer, adjoining the cavity region, comprises a bleed stopper structure having cutouts, wherein the bleed stopper structure having the cutouts is configured to inhibit capillary crimping or flowing of a DAF material of the DAF tape element in a partly liquefied state.

3. The device as claimed in claim 2 , wherein the bleed stopper structure is configured to exercise a capillary effect on the DAF material of the DAF tape element that is in a partly liquefied state.

4. The device as claimed in claim 2 , wherein the bleed stopper structure arranged in the spacer layer is configured, due to a capillary effect on the DAF material of the DAF tape element, to guide the partly liquefied DAF material in a targeted manner into the cutouts and to accommodate it there.

5. The device as claimed in claim 2 , wherein the bleed stopper structure is formed in the spacer layer between the cavity region and a solid material region of the spacer layer, wherein the spacer layer extends parallel to a main surface region of the base substrate and/or a main surface region of the stack element.

6. The device as claimed in claim 2 , wherein the cutouts formed in the spacer layer through the bleed stopper structure yield a defined predetermined accommodating volume for the partly liquefied DAF material to be accommodated of the DAF tape element.

7. The device as claimed in claim 2 , wherein the cutouts are arranged in the bleed stopper structure in a manner adjoining the cavity region and furthermore in a manner adjacent to one another around the cavity region and extend parallel to a main surface region of the base substrate between the DAF stack element with the DAF tape element arranged thereon and the base substrate.

8. The device as claimed in claim 7 , wherein at least one portion of the cutouts of the bleed stopper structure, adjoining the cavity region, is formed in a rectangular fashion.

9. The device as claimed in claim 7 , wherein at least one portion of the cutouts of the bleed stopper structure is formed in a widening or tapering fashion in the direction of the cavity region.

10. The device as claimed in claim 9 , wherein at least one portion of the cutouts of the bleed stopper structure, adjoining the cavity region, is formed in a sawtooth shaped fashion.

11. The device as claimed in claim 2 , wherein the bleed stopper structure comprises a columnar structure having a multiplicity of mutually spaced apart columns formed perpendicular to the main surface region of the base substrate with cutouts formed between adjacent columns.

12. The device as claimed in claim 2 , wherein the bleed stopper structure comprises a trench structure in the spacer layer, adjoining the cavity region.

13. The device as claimed in claim 2 , wherein the cavity region is formed in a rectangular fashion parallel to the main surface region of the base substrate, wherein the cutouts which are formed in the bleed stopper structure of the spacer layer and which adjoin corner regions of the rectangular cavity region are dimensioned to be larger, at least by a factor of 1.5, than the remaining cutouts at side regions of the rectangular cavity region.

14. The device as claimed in claim 2 , wherein the cutouts formed in the bleed stopper structure of the spacer layer are arranged symmetrically around the cavity region with the sensor component situated therein.

15. The device as claimed in claim 1 , wherein the spacer layer has a thickness in a range of between 5 and 50 μm or in a range of between 10 and 20 μm.

16. The device as claimed in claim 1 , wherein the DAF tape element has a thickness in a range of 5 to 50 μm or in a range of 12 to 20 μm.

17. The device as claimed in claim 1 , wherein the DAF tape element comprises a bi-stage material.

18. The device as claimed in claim 1 , wherein the spacer layer comprises a plastics material from the imide group or an epoxy material.

19. The device as claimed in claim 2 , wherein the bleed stopper structure arranged in the spacer layer is configured, due to a capillary effect on the partly liquefied DAF material of the DAF tape element, at least to inhibit capillary creeping or flowing of the partly liquefied DAF material of the DAF tape element into the cavity region.

Assignees

• Infineon Technologies Ag

Inventors

• Steiert Matthias
• Gierl Karolina

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/01361

  Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01351) · CPC title

• H10W72/385

  Alignment aids, e.g. alignment marks · CPC title

• H10W74/014

  using batch processing · CPC title

• H10W72/30 Primary

  Die-attach connectors · CPC title