Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-2024178175-A1 · May 30, 2024 · US
Providing thermal transfer, e.g. thermal bumps
Providing thermal transfer, e.g. thermal bumps · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/265 |
| Official title | {Providing thermal transfer, e.g. thermal bumps} |
| Display label | Providing thermal transfer, e.g. thermal bumps |
| Total patents | 363 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 40 |
| 2017 | 29 |
| 2018 | 39 |
| 2019 | 25 |
| 2020 | 43 |
| 2021 | 28 |
| 2022 | 37 |
| 2023 | 30 |
| 2024 | 31 |
| 2025 | 28 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device
US-9524946-B2 · Dec 20, 2016 · US
Bonding pads with thermal pathways
US-9515002-B2 · Dec 6, 2016 · US
Fabricating pillar solder bump
US-9508594-B2 · Nov 29, 2016 · US
Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal
US-9490226-B2 · Nov 8, 2016 · US
Integrated circuit chip assembled on an interposer
US-2016322276-A1 · Nov 3, 2016 · US
Embedded graphite heat spreader for 3dic
US-2016260687-A1 · Sep 8, 2016 · US
Integrated circuit chip assembled on an interposer
US-9418954-B2 · Aug 16, 2016 · US
Semiconductor die assemblies with heat sink and associated systems and methods
US-2016233110-A1 · Aug 11, 2016 · US
Thermal management in electronic devices with yielding substrates
US-2016204324-A1 · Jul 14, 2016 · US
Semiconductor structures including fluidic microchannels for cooling and related methods
US-9391011-B2 · Jul 12, 2016 · US
Thermal vias disposed in a substrate without a liner layer
US-2016197026-A1 · Jul 7, 2016 · US
Methods and apparatus for package on package devices
US-9373599-B2 · Jun 21, 2016 · US
Semiconductor package
US-2016172269-A1 · Jun 16, 2016 · US
Semiconductor package
US-2016172291-A1 · Jun 16, 2016 · US
Semiconductor packages
US-2016133542-A1 · May 12, 2016 · US
Printed circuit board and semiconductor package
US-2016135326-A1 · May 12, 2016 · US
Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems
US-9337119-B2 · May 10, 2016 · US
Thermal management in electronic devices with yielding substrates
US-9324930-B2 · Apr 26, 2016 · US
Semiconductor package with thermal via and method for fabrication thereof
US-9312206-B2 · Apr 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/265?
- CPC H10W72/265 is the Cooperative Patent Classification code for “Providing thermal transfer, e.g. thermal bumps.”
- How many patents are filed under CPC H10W72/265 (Providing thermal transfer, e.g. thermal bumps)?
- Our database includes 363 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/265 growing?
- Publication counts under this code: 31 in 2024 vs 28 in 2025 (latest complete years).