Power leadframe package with lead sidewall surface that is fully solder wettable
US-2024274572-A1 · Aug 15, 2024 · US
Mechanical treatments, e.g. punching, cutting, deforming or cold welding
Mechanical treatments, e.g. punching, cutting, deforming or cold welding · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/048 |
| Official title | {Mechanical treatments, e.g. punching, cutting, deforming or cold welding} |
| Display label | Mechanical treatments, e.g. punching, cutting, deforming or cold welding |
| Total patents | 1,040 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 86 |
| 2016 | 75 |
| 2017 | 102 |
| 2018 | 101 |
| 2019 | 115 |
| 2020 | 99 |
| 2021 | 91 |
| 2022 | 72 |
| 2023 | 83 |
| 2024 | 90 |
| 2025 | 101 |
| 2026 | 25 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and apparatus for semiconductor testing at low temperature
US-9224659-B2 · Dec 29, 2015 · US
Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound
US-9219019-B2 · Dec 22, 2015 · US
Non-leaded type semiconductor package and method of assembling same
US-9214447-B2 · Dec 15, 2015 · US
Semiconductor device and method of manufacturing the same
US-2015357264-A1 · Dec 10, 2015 · US
Integrated circuit module with lead frame micro-needles
US-9202705-B1 · Dec 1, 2015 · US
Metal base substrate, power module, and method for manufacturing metal base substrate
US-2015332982-A1 · Nov 19, 2015 · US
Semiconductor device with webbing between leads
US-9190351-B2 · Nov 17, 2015 · US
Method of singularizing packages and leadframe
US-2015325503-A1 · Nov 12, 2015 · US
Semiconductor device with step portion having shear surfaces
US-2015325502-A1 · Nov 12, 2015 · US
Power semiconductor module and method of manufacturing the same
US-2015318189-A1 · Nov 5, 2015 · US
Packaged integrated circuit device having bent leads
US-9177836-B1 · Nov 3, 2015 · US
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US-9171761-B2 · Oct 27, 2015 · US
Universal Lead Frame for Flat No-Leads Packages
US-2015303134-A1 · Oct 22, 2015 · US
Semiconductor device and method for manufacturing semiconductor device
US-2015294952-A1 · Oct 15, 2015 · US
Method for manufacturing semiconductor device
US-2015294870-A1 · Oct 15, 2015 · US
Method of manufacturing semiconductor device
US-9153527-B2 · Oct 6, 2015 · US
Semiconductor device and method of manufacturing the same
US-9147647-B2 · Sep 29, 2015 · US
Lead frame, method for manufacturing lead frame and semiconductor device using same
US-9147646-B2 · Sep 29, 2015 · US
Semiconductor power converter and method of manufacturing the same
US-9147673-B2 · Sep 29, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/048?
- CPC H10W70/048 is the Cooperative Patent Classification code for “Mechanical treatments, e.g. punching, cutting, deforming or cold welding.”
- How many patents are filed under CPC H10W70/048 (Mechanical treatments, e.g. punching, cutting, deforming or cold welding)?
- Our database includes 1,040 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/048 growing?
- Publication counts under this code: 90 in 2024 vs 101 in 2025 (latest complete years).