Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor power converter and method of manufacturing the same
US9147673B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9147673-B2 |
| Application number | US-201314025019-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 12, 2013 |
| Priority date | Oct 31, 2012 |
| Publication date | Sep 29, 2015 |
| Grant date | Sep 29, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
According to one embodiment, a semiconductor power converter includes first and second electrical conductors opposed to each other, first and second semiconductor elements joined to a first joint surface of the first electrical conductor, first and second convex electrical conductors joined to the first and second semiconductor elements, a junction joined to the first and second convex electrical conductors and a second joint surface of the second electrical conductor, power terminals, signal terminals, and an envelope sealing the constituent members. The envelope includes a flat bottom surface which extends perpendicular to the semiconductor elements and in which first and second bottom surfaces of the electrical conductors are exposed.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a semiconductor power converter, comprising: mounting a first connecting body and a second connecting body on a first joint surface of a first electrical conductor; mounting a plate-shaped first semiconductor element, which comprises different electrodes on the obverse and reverse surfaces thereof, on the first connecting body so that one of the electrodes contacts the first connecting body; mounting a plate-shaped second semico…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9147673B2 cover?
- According to one embodiment, a semiconductor power converter includes first and second electrical conductors opposed to each other, first and second semiconductor elements joined to a first joint surface of the first electrical conductor, first and second convex electrical conductors joined to the first and second semiconductor elements, a junction joined to the first and second convex electric…
- Who is the assignee on this patent?
- Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).