Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator
US-2019393165-A1 · Dec 26, 2019 · US
for decoupling, e.g. bypass capacitors
for decoupling, e.g. bypass capacitors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W44/243 |
| Official title | {for decoupling, e.g. bypass capacitors} |
| Display label | for decoupling, e.g. bypass capacitors |
| Total patents | 169 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 13 |
| 2017 | 11 |
| 2018 | 13 |
| 2019 | 20 |
| 2020 | 33 |
| 2021 | 15 |
| 2022 | 15 |
| 2023 | 14 |
| 2024 | 15 |
| 2025 | 10 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
High speed semiconductor chip stack
US-10504843-B2 · Dec 10, 2019 · US
Integrated circuit chip with molding compound handler substrate and method
US-10446442-B2 · Oct 15, 2019 · US
Capacitor die embedded in package substrate for providing capacitance to surface mounted die
US-2019304935-A1 · Oct 3, 2019 · US
Vertical Electrode Decoupling/Bypass Capacitor
US-2019295771-A1 · Sep 26, 2019 · US
Channel loss compensation circuits
US-2019260407-A1 · Aug 22, 2019 · US
Amplifiers and amplifier modules with shunt inductance circuits that include high-Q capacitors
US-10381984-B2 · Aug 13, 2019 · US
Housing for a high-frequency chip
US-10365145-B2 · Jul 30, 2019 · US
Vertical capacitors for microelectronics
US-2019214353-A1 · Jul 11, 2019 · US
Design and placement of de-coupling capacitors for pdn design
US-2019206815-A1 · Jul 4, 2019 · US
Tunable differential via circuit
US-2019164891-A1 · May 30, 2019 · US
Channel loss compensation circuits
US-10298277-B2 · May 21, 2019 · US
Semiconductor device, semiconductor device manufacturing method, and electronic device
US-2019131258-A1 · May 2, 2019 · US
Radio frequency (RF) devices with resonant circuits to reduce coupling
US-10249582-B2 · Apr 2, 2019 · US
Capacitor and board having the same
US-2019019787-A1 · Jan 17, 2019 · US
Capacitor and board having the same
US-10181461-B1 · Jan 15, 2019 · US
Guard bond wires in an integrated circuit package
US-2019006286-A1 · Jan 3, 2019 · US
High speed semiconductor chip stack
US-2018358295-A1 · Dec 13, 2018 · US
Transistor layout with low aspect ratio
US-10153306-B2 · Dec 11, 2018 · US
Microwave module
US-2018351595-A1 · Dec 6, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W44/243?
- CPC H10W44/243 is the Cooperative Patent Classification code for “for decoupling, e.g. bypass capacitors.”
- How many patents are filed under CPC H10W44/243 (for decoupling, e.g. bypass capacitors)?
- Our database includes 169 publications tagged with this CPC code.
- Is patent activity under CPC H10W44/243 growing?
- Publication counts under this code: 15 in 2024 vs 10 in 2025 (latest complete years).