Flexible base design for chipset heat sink

Patent metadata

Field	Value
Publication number	US-11049793-B2
Application number	US-201916358250-A
Country	US
Kind code	B2
Filing date	Mar 19, 2019
Priority date	Mar 19, 2019
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

First claim

We claim:

1. A flexible heat sink, the heat sink comprising:
a heat conductive metal, the metal comprising a first uninterrupted surface designed to contact a heat source and a second surface opposite the first surface; and
the second surface being configured as a series of concentric grooves;
the concentric grooves being configured as a plurality of valleys in the second surface;
the number of the plurality of valleys, and a shape and a depth of each of the plurality of valleys being configured such that the first uninterrupted surface is enabled to flex into a convex shape without breaking when a directed force is applied to the second surface at the center of the series of concentric grooves in a direction towards the first uninterrupted surface, while, at the same time, allowing the second surface to flex.

2. The flexible heat sink of claim 1 , further comprising a central cylinder; the central cylinder being located at the center of the concentric grooves.

3. The flexible heat sink of claim 2 , wherein the central cylinder is integral with the heat conductive metal.

4. The flexible heat sink of claim 2 , further comprising a spring to apply a biasing force to the central cylinder.

5. The flexible heat sink of claim 4 , further comprising at least one fin in contact with the spring and the central cylinder.

6. The flexible heat sink of claim 5 , further comprising a plurality of screws, each screw passing through the spring, the fin, and the heat sink.

7. The flexible heat sink of claim 2 , further comprising a plurality of depressions on said second surface in addition to the series of concentric grooves.

8. The flexible heat sink of claim 7 , further comprising at least one heat pipe in the plurality of depressions.

9. The flexible heat sink of claim 1 , wherein the heat conductive metal comprises copper.

10. The combination of a heat source and a flexible heat sink, wherein the heat source comprises a concave upper surface; and the flexible heat sink comprises:
a heat conductive metal, the metal comprising an uninterrupted first surface designed to contact a heat source and a second surface opposite the first surface; and
the second surface being configured as a series of concentric grooves;
the concentric grooves being configured as a plurality of valleys in the second surface;
the number of the plurality of valleys, and a shape and a depth of each of the plurality of valleys being configured such that the first uninterrupted surface is enabled to flex into a convex shape without breaking when a directed force is applied to the second surface at the center of the series of concentric grooves in a direction towards the first uninterrupted surface, while, at the same time, allowing the second surface to flex.

11. The combination of claim 10 , wherein the first uninterrupted surface is flat in a first configuration and convex in a second configuration.

12. The combination of claim 11 , wherein the heat source is a chipset.

13. The combination of claim 11 , further comprising at least one fin, the at least one fin remaining in contact with a central cylinder when the first surface is in the second configuration.

14. The combination of claim 13 , further comprising a spring to bias the central cylinder and cause the first surface to enter the second configuration.

15. The combination of claim 14 , wherein the spring is H-shaped, comprising four arms connected to a central portion, and the central portion is in contact with the central cylinder.

16. A method for conductively transferring heat from a chipset to a heat sink; wherein the chipset has a concave upper surface and the heat sink has a flexible surface, the method comprising:
providing a heat sink comprising a heat conductive metal, the metal comprising an uninterrupted first surface designed to contact a heat source and a second surface opposite the first surface; and
the second surface being configured as a series of concentric grooves;
the concentric grooves being configured as a plurality of valleys in the second surface;
the number of the plurality of valleys, and a shape and a depth of each of the plurality of valleys being configured such that the first uninterrupted surface is enabled to flex into a convex shape without breaking when a directed force is applied to the second surface at the center of the series of concentric grooves in a direction towards the first uninterrupted surface, while, at the same time, allowing the second surface to flex;
the heat sink further comprising a central cylinder; the central cylinder being located at the center of the concentric grooves;
applying a biasing force on the central cylinder thereby flexing the first uninterrupted surface of the heat sink into a convex shape so as to contact the concave upper surface of the chipset, and transfer heat between the chipset and the heat sink by conduction.

17. The method of claim 16 , further comprising providing a spring as the biasing force.

Assignees

• Quanta Comp Inc

Inventors

• Chen Chao-Jung
• Huang Yu-Nien
• Wu Kuen-Hsien
• Liang Shih-I

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/231

  characterised by their places of attachment or cooling paths · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/77

  Auxiliary members characterised by their shape · CPC title