Selective etching process for SiGe and doped epitaxial silicon
US-12062571-B2 · Aug 13, 2024 · US
attached to chips
attached to chips · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W40/233 |
| Official title | {attached to chips} |
| Display label | attached to chips |
| Total patents | 125 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 6 |
| 2017 | 3 |
| 2018 | 8 |
| 2019 | 13 |
| 2020 | 12 |
| 2021 | 12 |
| 2022 | 14 |
| 2023 | 15 |
| 2024 | 18 |
| 2025 | 15 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms
US-11158564-B1 · Oct 26, 2021 · US
Semiconductor module and vehicle
US-2021313249-A1 · Oct 7, 2021 · US
Apparatus and method for holding a heat generating device
US-2021305125-A1 · Sep 30, 2021 · US
Package and Method for Manufacturing the Same
US-2021305123-A1 · Sep 30, 2021 · US
Circuit board assembly and electronic device
US-2021212193-A1 · Jul 8, 2021 · US
System, device and methods of manufacture
US-2021202312-A1 · Jul 1, 2021 · US
Adjustable heat sink fin spacing
US-11035625-B2 · Jun 15, 2021 · US
Back plate assembly and electronic device
US-2021143083-A1 · May 13, 2021 · US
Semiconductor assembly
US-10998249-B2 · May 4, 2021 · US
Adjustable heat sink fin spacing
US-10948247-B2 · Mar 16, 2021 · US
Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms
US-10943848-B1 · Mar 9, 2021 · US
Semiconductor assembly
US-2021005529-A1 · Jan 7, 2021 · US
Microelectronic components having integrated heat dissipation posts and systems including the same
US-10861764-B2 · Dec 8, 2020 · US
Heat dissipation structure and heat dissipation method
US-2020359525-A1 · Nov 12, 2020 · US
Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
US-2020343154-A1 · Oct 29, 2020 · US
Cable connector assembly for an integrated circuit assembly
US-10811800-B1 · Oct 20, 2020 · US
Electronic device apparatus with multiple thermally conductive paths for heat dissipation
US-10720377-B2 · Jul 21, 2020 · US
Integrated electronic device
US-2020196480-A1 · Jun 18, 2020 · US
Integrated electronic device
US-10674640-B1 · Jun 2, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W40/233?
- CPC H10W40/233 is the Cooperative Patent Classification code for “attached to chips.”
- How many patents are filed under CPC H10W40/233 (attached to chips)?
- Our database includes 125 publications tagged with this CPC code.
- Is patent activity under CPC H10W40/233 growing?
- Publication counts under this code: 18 in 2024 vs 15 in 2025 (latest complete years).