Adjustable heat sink fin spacing

Patent metadata

Field	Value
Publication number	US-10948247-B2
Application number	US-201916519632-A
Country	US
Kind code	B2
Filing date	Jul 23, 2019
Priority date	Apr 18, 2016
Publication date	Mar 16, 2021
Grant date	Mar 16, 2021

Abstract

A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod may include a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

First claim

What is claimed is:

1. A heat sink comprising:
a first heat sink fin comprising a first internal thread;
a second heat sink fin comprising a second internal thread of a different thread pitch relative to the first internal thread; and
a threaded rod comprising: a first portion comprising a first external thread that engages with the first internal thread; and a second portion comprising a second external thread that engages with the second internal thread.

2. The heat sink of claim 1 , further comprising a motor that rotates the threaded rod.

3. The heat sink of claim 2 , wherein upon the rotation of the threaded rod, the first fin is displaced against the first portion by a first dimension and the second fin is displaced against the second portion by a second dimension.

4. The heat sink of claim 1 , wherein the pitch of the first internal thread is smaller than the pitch of the second internal thread.

5. The heat sink of claim 1 , wherein rotation of the first heat sink fin is fixed relative to rotation of the second heat sink fin.

6. The heat sink of claim 1 , further comprising:
a first fin temperature sensing device that measures temperature of the first heat sink fin.

7. The heat sink of claim 6 , further comprising:
a second fin temperature sensing device that measures temperature of the second heat sink fin.

8. The heat sink of claim 1 , further comprising:
a temperature sensing device that measures temperature of a heat generating device thermally connected to the first heat sink fin and to the second heat sink fin.

9. The heat sink of claim 1 , further comprising:
a base comprising an upper surface and a lower surface that is configured to contact a heat generating device, wherein the first heat sink fin and the second heat sink fin are parallel to the upper surface of the base.

10. The heat sink of claim 1 , further comprising:
a base comprising an upper surface and a lower surface that is configured to contact a heat generating device; and
a riser extending from the upper surface of the base;
wherein the first heat sink fin and the second heat sink fin are orthogonal to the upper surface of the base.

Assignees

• IBM

Inventors

• Bodenweber Paul F
• Sikka Kamal K

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/237

  attached to additional arrangements for cooling · CPC title