Adjustable heat sink fin spacing

US11035625B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11035625-B2
Application numberUS-201916519675-A
CountryUS
Kind codeB2
Filing dateJul 23, 2019
Priority dateApr 18, 2016
Publication dateJun 15, 2021
Grant dateJun 15, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A heat sink includes a threaded rod. The threaded rod includes a first portion and a second portion. The first portion may engage with a first heat sink fin and a second portion may engage with a second heat sink fin. The first portion includes a first external thread of a first diameter. The second portion includes a second external thread also of the first diameter and of different pitch than the first external thread. For example, the pitch of a first knurl of the threaded rod may be smaller than the pitch of a second threaded knurl of the threaded rod. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat sink comprising: a threaded rod comprising: a first portion comprising a first external thread of a first diameter; and a second portion comprising a second external thread also of the first diameter and of different pitch than the first external thread. 2. The heat sink of claim 1 , further comprising a motor that rotates the threaded rod. 3. The heat sink of claim 1 , wherein the pitch of the first external thread is smaller than the pitch of the second external thread. 4. The heat sink of claim 1 , wherein the first portion and the second portion share a same axis of rotation. 5. The heat sink of claim 4 , wherein the first portion further comprises one or more protrusions. 6. The heat sink of claim 4 , wherein the second portion comprises one or more receptacles configured to accept the one or more protrusions. 7. The heat sink of claim 1 , wherein the pitch of the first portion is the same as a first internally threaded hole of a first heat sink fin of the heat sink. 8. The heat sink of claim 7 , wherein the pitch of the second portion is the same as a second internally threaded hole of a second heat sink fin of the heat sink. 9. The heat sink of claim 1 , wherein the first external thread engages with a first internally threaded hole of a first heat sink fin of the heat sink. 10. The heat sink of claim 9 , wherein the second external thread engages with a second internally threaded hole of a second heat sink fin of the heat sink.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • on active surfaces of flip-chip devices, e.g. underfills · CPC title

  • Bump connectors and die-attach connectors · CPC title

  • attached to additional arrangements for cooling · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11035625B2 cover?
A heat sink includes a threaded rod. The threaded rod includes a first portion and a second portion. The first portion may engage with a first heat sink fin and a second portion may engage with a second heat sink fin. The first portion includes a first external thread of a first diameter. The second portion includes a second external thread also of the first diameter and of different pitch than…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10W40/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 15 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).