Method for fabricating an integrated circuit device
US-12087712-B2 · Sep 10, 2024 · US
Generic parts of integrated devices, not otherwise provided for
Generic parts of integrated devices, not otherwise provided for · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W29/00 |
| Official title | Generic parts of integrated devices, not otherwise provided for |
| Display label | Generic parts of integrated devices, not otherwise provided for |
| Total patents | 76 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 9 |
| 2017 | 1 |
| 2018 | 6 |
| 2019 | 13 |
| 2020 | 2 |
| 2021 | 6 |
| 2022 | 5 |
| 2023 | 9 |
| 2024 | 10 |
| 2025 | 6 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and method of manufacturing a semiconductor device
US-2024297127-A1 · Sep 5, 2024 · US
Methods of manufacturing semiconductor chip including crack propagation guide
US-11990372-B2 · May 21, 2024 · US
Memory device, method of manufacturing memory device, and electronic apparatus including memory device
US-2023380133-A1 · Nov 23, 2023 · US
System for designing thermal sensor arrangement
US-11810813-B2 · Nov 7, 2023 · US
Semiconductor metal layer structure over cell region
US-2023281373-A1 · Sep 7, 2023 · US
Semiconductor memory devices including separate upper and lower bit line spacers and methods of forming the same
US-11744063-B2 · Aug 29, 2023 · US
Method for fabricating an integrated circuit device
US-2023230938-A1 · Jul 20, 2023 · US
Ic having electrically isolated warpage prevention structures
US-2023139898-A1 · May 4, 2023 · US
Method for fabricating an integrated circuit device
US-11637080-B2 · Apr 25, 2023 · US
Shielding using layers with staggered trenches
US-11626366-B2 · Apr 11, 2023 · US
Seal ring reinforcement
US-2023043166-A1 · Feb 9, 2023 · US
Shielding using layers with staggered trenches
US-2022406708-A1 · Dec 22, 2022 · US
Methods of manufacturing semiconductor chip including crack propagation guide
US-2022319924-A1 · Oct 6, 2022 · US
Array substrate and manufacturing method thereof
US-11462491-B2 · Oct 4, 2022 · US
Capacitor integrated in finfet device and method for fabricating the same
US-2022246604-A1 · Aug 4, 2022 · US
Stressed substrates for transient electronic systems
US-RE49059-E · May 3, 2022 · US
Method for fabricating an integrated circuit device
US-2021375800-A1 · Dec 2, 2021 · US
Semiconductor memory devices including separate upper and lower bit line spacers and methods of forming the same
US-2021343724-A1 · Nov 4, 2021 · US
Array substrate and manufacturing method thereof
US-2021335732-A1 · Oct 28, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W29/00?
- CPC H10W29/00 is the Cooperative Patent Classification code for “Generic parts of integrated devices, not otherwise provided for.”
- How many patents are filed under CPC H10W29/00 (Generic parts of integrated devices, not otherwise provided for)?
- Our database includes 76 publications tagged with this CPC code.
- Is patent activity under CPC H10W29/00 growing?
- Publication counts under this code: 10 in 2024 vs 6 in 2025 (latest complete years).