Treatment methods for silicon nanosheet surfaces
US-2024055265-A1 · Feb 15, 2024 · US
for altering the shape of semiconductors, e.g. smoothing the surface
for altering the shape of semiconductors, e.g. smoothing the surface · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P95/906 |
| Official title | {for altering the shape of semiconductors, e.g. smoothing the surface} |
| Display label | for altering the shape of semiconductors, e.g. smoothing the surface |
| Total patents | 509 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 46 |
| 2016 | 85 |
| 2017 | 86 |
| 2018 | 49 |
| 2019 | 44 |
| 2020 | 45 |
| 2021 | 33 |
| 2022 | 41 |
| 2023 | 37 |
| 2024 | 21 |
| 2025 | 19 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods of fabricating a semiconductor device
US-9530870-B2 · Dec 27, 2016 · US
Method of manufacturing semiconductor device and semiconductor device
US-2016372583-A1 · Dec 22, 2016 · US
Method of improving line roughness in substrate processing
US-9508557-B2 · Nov 29, 2016 · US
Method for manufacturing silicon carbide semiconductor device
US-9450068-B2 · Sep 20, 2016 · US
Power semiconductor device and method
US-9431490-B2 · Aug 30, 2016 · US
FinFETs and Methods for Forming the Same
US-2016247900-A1 · Aug 25, 2016 · US
Depression filling method and processing apparatus
US-2016240379-A1 · Aug 18, 2016 · US
Semiconductor structure in which film including germanium oxide is provided on germanium layer, and method for manufacturing semiconductor structure
US-2016218182-A1 · Jul 28, 2016 · US
Method of removing threading dislocation defect from a fin feature of III-V group semiconductor material
US-9368604-B1 · Jun 14, 2016 · US
Semiconductor structure and manufacturing method thereof
US-2016079420-A1 · Mar 17, 2016 · US
Method of manufacturing semiconductor device
US-2016064397-A1 · Mar 3, 2016 · US
Localized fin width scaling using a hydrogen anneal
US-9263554-B2 · Feb 16, 2016 · US
Thin oxide formation by wet chemical oxidation of semiconductor surface when the one component of the oxide is water soluble
US-2016027894-A1 · Jan 28, 2016 · US
Semiconductor device including a trench in a semiconductor substrate and method of manufacturing a semiconductor device
US-9219144-B2 · Dec 22, 2015 · US
High voltage integrated devices, methods of fabricating the same, electronic devices including the same, and electronic systems including the same
US-9214548-B1 · Dec 15, 2015 · US
Electrochemical plating methods
US-2015357195-A1 · Dec 10, 2015 · US
Semiconductor device and method for manufacturing same
US-9209294-B1 · Dec 8, 2015 · US
Depositing an etch stop layer before a dummy cap layer to improve gate performance
US-9209258-B2 · Dec 8, 2015 · US
Semiconductor-on-insulator wafer manufacturing method for reducing light point defects and surface roughness
US-9202711-B2 · Dec 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P95/906?
- CPC H10P95/906 is the Cooperative Patent Classification code for “for altering the shape of semiconductors, e.g. smoothing the surface.”
- How many patents are filed under CPC H10P95/906 (for altering the shape of semiconductors, e.g. smoothing the surface)?
- Our database includes 509 publications tagged with this CPC code.
- Is patent activity under CPC H10P95/906 growing?
- Publication counts under this code: 21 in 2024 vs 19 in 2025 (latest complete years).