Low profile wire bonded USB device
US-8947883-B2 · Feb 3, 2015 · US
Low profile wire bonded USB device
US9218953B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9218953-B2 |
| Application number | US-201514612115-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2015 |
| Priority date | Dec 27, 2007 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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Abstract
Official abstract text for this publication.
A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
First claim
Opening claim text (preview).
We claim: 1. A method of fabricating a USB flash memory device, comprising the steps of: (a) defining a conductance pattern on a substrate; (b) forming connector pins on the same substrate, the connector pins capable of mating within a slot of a host device; (c) wirebonding one or more semiconductor die to the substrate; and (d) electrically coupling the one or more semiconductor die to the connector pins via the conductance pattern. 2. A method as reci…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P95/00Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9218953B2 cover?
- A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive compo…
- Who is the assignee on this patent?
- Sandisk Technologies Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P95/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).