Method and apparatus for treating substrate

Patent metadata

Field	Value
Publication number	US-11972939-B2
Application number	US-202016901913-A
Country	US
Kind code	B2
Filing date	Jun 15, 2020
Priority date	Jun 17, 2019
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

The inventive concept provides a method for treating a substrate. The method includes removing a film on the substrate by applying a pulsed laser to the rotating substrate, in which thickness of the film to be removed is measured and pulse energy of the pulsed laser is selected based on the measured thickness of the film.

First claim

What is claimed is:

1. An apparatus for treating a substrate, the apparatus comprising:
a housing having an interior space;
a chuck configured to support and rotate the substrate in the interior space;
a laser configured to apply a pulsed laser to remove a film on the substrate supported on the chuck;
a scanner configured to measure thickness of the film on the substrate, the scanner being located in a fixed position above the substrate; and
a controller configured to control the laser and the scanner,
wherein the controller includes:
a recipe memory in which treatment conditions for removing the film on the substrate are recorded; and
a processor configured to read the treatment conditions from the recipe memory and output a control signal to control pulse energy of the pulsed laser, based on the read treatment conditions,

wherein the processor:
reads the treatment conditions from the recipe memory depending on the thickness of the film measured by the scanner; and
outputs the control signal to control the pulse energy, based on the treatment conditions read from the recipe memory,

wherein the controller is programmed to cause the scanner to measure the thickness of the film on the substrate before removing the film on the substrate using the pulsed laser,
wherein the film includes a first film having a first type and a second film having a second type different from the first type of first film, the scanner identifying the first type and the second type during scanning the film,
wherein the controller is further programmed to, while the chuck is rotating, in real time continuously adjust the pulse energy based on the thickness of the film measured by the scanner and a type of the film being the first type or the second type, and
wherein the controller is further programmed to:
while removing the first film, read a first ablation energy, by which the first film is completely removed, from the recipe memory depending on a thickness of the first film and the first type of the first film measured by the scanner among the treatment conditions, and output the control signal to control the pulse energy, based on the first ablation energy read from the recipe memory; and
while removing the second film, read a second ablation energy, by which the second film is completely removed, from the recipe memory depending on a thickness of the second film and the second type of the second film measured by the scanner among the treatment conditions, and output the control signal to control the pulse energy, based on the second ablation energy read from the recipe memory.

2. The apparatus of claim 1 , wherein the controller outputs the control signal such that the pulse energy has energy corresponding to the first ablation energy and the second ablation energy.

3. The apparatus of claim 1 ,
wherein the first film and the second film are stacked on each other.

4. The apparatus of claim 3 , wherein the processor:
when removing the first film, outputs the control signal such that the pulse energy has energy corresponding to the first ablation energy; and
when removing the second film, outputs the control signal such that the pulse energy has energy corresponding to the second ablation energy.

5. The apparatus of claim 1 , wherein the processor adjusts the pulse energy by outputting a control signal to control output power of the pulsed laser and/or a repetition rate of the pulsed laser.

6. The apparatus of claim 1 , wherein the controller controls the laser to apply the pulsed laser to an edge area of the substrate.

7. The apparatus of claim 1 , wherein the controller controls the scanner such that an area where the thickness of the film is measured corresponds to an edge area of the substrate.

8. The apparatus of claim 1 , wherein the laser includes:
a laser source configured to emit the pulsed laser; and
a camera configured to take an image of an edge area of the substrate to measure an offset value between an illuminated position and a set position of the pulsed laser, and
wherein the laser is configured to change the illuminated position, based on the offset value.

Assignees

• Semes Co Ltd

Inventors

• Kwon Ohyeol
• Ahn Jun Keon
• Park Soo Young
• Lee Jung Hwan

Classifications

• H10P90/128

  by edge treatment, e.g. chamfering · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title