Method of mounting a module to a land grid array (LGA)
US-10834860-B2 · Nov 10, 2020 · US
with means for increasing contact pressure at the end of engagement of coupling parts · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K7/1007 |
| Official title | {with means for increasing contact pressure at the end of engagement of coupling parts} |
| Display label | with means for increasing contact pressure at the end of engagement of coupling parts |
| Total patents | 96 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 6 |
| 2017 | 14 |
| 2018 | 16 |
| 2019 | 11 |
| 2020 | 10 |
| 2021 | 7 |
| 2022 | 10 |
| 2023 | 7 |
| 2024 | 4 |
| 2025 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-10834860-B2 · Nov 10, 2020 · US
US-10559906-B2 · Feb 11, 2020 · US
US-10541481-B2 · Jan 21, 2020 · US
US-10534033-B2 · Jan 14, 2020 · US
US-10485129-B2 · Nov 19, 2019 · US
US-2019313543-A1 · Oct 10, 2019 · US
US-2019302857-A1 · Oct 3, 2019 · US
US-10389053-B2 · Aug 20, 2019 · US
US-2019245287-A1 · Aug 8, 2019 · US
US-2019230807-A1 · Jul 25, 2019 · US
US-10274535-B2 · Apr 30, 2019 · US
US-2019123468-A1 · Apr 25, 2019 · US
US-10257952-B2 · Apr 9, 2019 · US
US-2019053393-A1 · Feb 14, 2019 · US
US-2019044265-A1 · Feb 7, 2019 · US
US-2018332747-A1 · Nov 15, 2018 · US
US-10116076-B2 · Oct 30, 2018 · US
US-10103463-B1 · Oct 16, 2018 · US
US-10062994-B2 · Aug 28, 2018 · US
US-2018238957-A1 · Aug 23, 2018 · US
Answers are generated from the same data shown on this page.