Securement of solder unit upon contact

Patent metadata

Field	Value
Publication number	US-10559906-B2
Application number	US-201816170000-A
Country	US
Kind code	B2
Filing date	Oct 24, 2018
Priority date	Oct 24, 2017
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

An electronic component includes a first module, a second module and a third module between the first module and the second module. Each of the first module and the second module includes a plurality of conductive pads thereon. A connecting part includes a plate body and a plurality of first tails and a plurality of second tails respectively extending on two opposite sides of the plate body wherein the first tails are soldered upon the first conductive pads and the second tails are soldered upon the second conductive pads, respectively. Each of the first tails and the second tails includes a mounting pad with a through hole therein, and a folded section on the end edge with a solder unit received with a space formed in the folded section and communicatively above the corresponding through hole.

First claim

What is claimed is:

1. An electronic component comprising:
a module sub-assembly including at least a first module a second module, the first module forming a plurality of first conductive pads, the second module forming a plurality of second conductive pads;
a connecting part including a body and a plurality of contact tails on two sides of the body to be respectively soldered upon the first conductive pads and the second conductive pads, respectively;
each of said contact tails including a mounting pad defining opposite top surface and undersurface with a through hole extending therethrough in a vertical direction; and
a plurality of solder units each secured to the corresponding mounting pad before a reflow process, and filling the corresponding through hole after the reflow process and extending below the undersurface to secure the mounting pad and the conductive pad together; wherein

before the reflow process, the solder unit is located upon the top surface of the mounting pad and grasped by a folded section of the mounting pad.

2. The electronic component as claimed in claim 1 , wherein said folded section extends obliquely.

3. The electronic component as claimed in claim 1 , wherein the solder unit enters the corresponding through hole in an interference fit before the reflow process.

4. The electronic component as claimed in claim 1 , wherein the contact tail has a connecting section linked between the body and the mounting pad, and said connecting section extends in an oblique direction.

5. The electronic component as claimed in claim 1 , further includes a third module sandwiched between the first module and the second module, wherein the body of the connecting part is fixed to the third body.

6. The electronic component as claimed in claim 1 , wherein the through hole is smaller than a cross-section of the solder unit.

7. The electronic component as claimed in claim 3 , wherein there are a plurality of recesses and corresponding protrusions on a periphery of the through hole.

8. The electrical component as claimed in claim 4 , wherein a slot is formed in the connecting section.

9. The electronic component as claimed in claim 5 , wherein the connecting part is mechanically connected to the third module while is mechanically and electrically connected to the first module and the second module.

10. A method of making mechanical and electrical connection between a connecting part and a module sub-assembly, comprising steps of:
providing a plurality of contact tails on the connecting part, each of said contact tails including a mounting pad with opposite top surface and undersurface and a through hole extending therethrough in a vertical direction;
providing a plurality of conductive pads on the module sub-assembly;
fixing a plurality of solder units on the mounting pads, respectively;
reflowing the solder units to have the melted solder units extend downwardly through the corresponding through holes beyond the undersurfaces of the mounting pads and secured to the corresponding conductive pads; wherein
the mounting pad includes a folded section to clamp the solder unit for fixing the soldering unit thereto.

11. The method as claimed in claim 10 , wherein the solder unit is received within the through hole in an interference fit before reflowing.

12. The method as claimed in claim 10 , wherein a horizontal dimension of the through hole is smaller than a cross-section of the solder unit.

13. The method as claimed in claim 10 , wherein each of the contact tails includes a connecting section linked to the mounting pad, and said connecting section extends obliquely.

14. The method as claimed in claim 10 , wherein the module sub-assembly includes a first module and a second module sandwiching a third module therebetween, and the contacting part is mechanically and electrically connected to both the first module and the second module while is only mechanically connected to the third module.

15. An electronic component comprising:
a module sub-assembly having a plurality of conductive pads thereon;
a metallic connecting part including a plate body and a plurality of contact tails at least on one side, each of the contact tails including a mounting pad with opposite top surface and undersurface in a vertical direction, and further with a through hole extending therethrough in the vertical direction;
a plurality of solder units fixed to the corresponding contact tails, respectively, and located at least in alignment with and above the corresponding through hole; wherein
the solder unit is melted to extend through the through hole and beyond the undersurface of the mounting pad for securing to the corresponding conductive pad; wherein
the mounting pad is further equipped with a folded section to clamp the corresponding solder unit toward the mounting pad.

16. The electronic component as claimed in claim 15 , wherein the through hole forms a plurality of recesses and protrusions for retain the solder unit in an interference fit before a reflow process.

17. The electronic component as claimed in claim 15 , wherein a horizontal dimension of the through hole is smaller than a cross-sectional of the solder unit.

Assignees

• Fu Ding Prec Component Shen Zhen Co Ltd
• Foxconn Interconnect Technology Ltd

Inventors

• Cheng Shan-Yong

Classifications

• H01R4/02

  Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} · CPC title

• H01R13/193 Primary

  Means for increasing contact pressure at the end of engagement of coupling part {, e.g. zero insertion force or no friction} · CPC title

• H05K7/1007

  with means for increasing contact pressure at the end of engagement of coupling parts · CPC title

• H05K7/023 Primary

  Stackable modules · CPC title