Method of mounting a module to a land grid array (LGA)

US10834860B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10834860-B2
Application numberUS-201816041173-A
CountryUS
Kind codeB2
Filing dateJul 20, 2018
Priority dateJun 2, 2016
Publication dateNov 10, 2020
Grant dateNov 10, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of mounting a module to a land grid array comprising: installing a first tool to a fixture, the first tool including at least one alignment member and at least one cavity partially defined by the at least one alignment member, the at least one cavity of the first tool is aligned with one or more corresponding sockets of the land grid array; installing the module through the at least one cavity such that the module is substantially aligned with the socket as the module is connected to the land grid array; removing a cover from another socket of the corresponding sockets of the land grid array; removably coupling a second tool to the first tool, the second tool defining a cavity aligned with the another socket; and installing another module through the cavity of the second tool such that the another module is substantially aligned with the another socket as the another socket is connected to the land grid array. 2. The method of claim 1 , wherein installing the module includes positioning a hand tool holding the module within the cavity of the second tool. 3. The method of claim 1 , further comprising: rotating the first tool about a rotational axis from an active position to an inactive position; removing a cover from one of the corresponding sockets; and rotating the first tool to the active position. 4. The method according to claim 3 , wherein the cover of the socket is removed before the module is connected to the land grid array. 5. The method of claim 1 , wherein at least one of the module and another module is a central processor module, and the other of the module and another module is a system control module.

Assignees

Inventors

Classifications

  • Means to simultaneously fasten three or more parts · CPC title

  • Means to simultaneously assemble multiple, independent conductors to terminal · CPC title

  • Hand tools therefor · CPC title

  • Means comprising hand-manipulatable implement · CPC title

  • Means comprising hand-manipulatable implement · CPC title

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Frequently asked questions

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What does patent US10834860B2 cover?
A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a mo…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H05K13/0447. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).