Side clamping BGA socket

Patent metadata

Field	Value
Publication number	US-10257952-B2
Application number	US-201715821227-A
Country	US
Kind code	B2
Filing date	Nov 22, 2017
Priority date	Apr 27, 2016
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

First claim

What is claimed is:

1. A socket apparatus for ball grid array (BGA) balls, comprising:
a base member of electrically insulative material, the base member configured to receive BGA balls in a first direction into the socket apparatus;
a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material;
a plate member extending in a row direction; and
a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a second direction substantially perpendicular to the first direction.

2. The socket apparatus of claim 1 , wherein the plurality of electrical contact members correspond to a terminal ball configuration of a BGA to be mated with the socket apparatus.

3. The socket apparatus of claim 1 , wherein the plurality of extension members are arranged in parallel.

4. The socket apparatus of claim 1 , wherein the plurality electrical contact members alternate in a row direction with the plurality of extension members.

5. The socket apparatus of claim 1 , wherein the electrical contact members are arc shaped.

6. The socket apparatus of claim 1 , wherein the plurality of extension members include a plurality of nodules on each extension member, the nodules making contact with BGA balls of a BGA when the plate member is pulled in the first direction.

7. The socket apparatus of claim 6 , wherein the plurality of nodules are insulative.

8. The socket apparatus of claim 6 , wherein the nodules are wedge shaped having a wide end that tapers down to a narrow portion.

9. The socket apparatus of claim 6 , wherein the nodules take the form of a diamond, triangle, or curved triangle shape.

10. The socket apparatus of claim 1 , wherein the balls of the BGA are secured to the socket apparatus by lateral forces applied by the plurality of electrical contact members and extension members.

11. The socket apparatus of claim 1 , wherein the second direction is a lateral direction from one electrical contact to another electrical contact.

12. A method of securing a ball grid array (BGA) to a socket including a base member of electrically insulative material, the base member configured to receive BGA balls in a first direction into the socket apparatus, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a second direction substantially perpendicular to the first direction, the method comprising:
mounting the BGA into the socket in the first direction; and
moving the plate member and the extension members in the second direction to urge mounted BGA balls into electrical contact engagement with the electrical contact members and secure the BGA to the socket.

13. The method of claim 12 , comprising securing the BGA balls of the BGA to the socket by lateral forces applied by the corresponding electrical contacts.

14. The method of claim 12 , wherein the plurality of extension members include a plurality of nodules on each extension member, the nodules making contact with BGA balls of a BGA when the plate member is pulled in the first direction.

15. The method of claim 14 , wherein the extension members and nodules are made of an insulating material.

16. The method of claim 14 , wherein the nodules are wedge shaped having a wide end that tapers down to a narrow portion.

17. The method of claim 14 , wherein the nodules take the form of a diamond, triangle, or curved triangle shape.

18. The method of claim 12 , wherein the second direction is a lateral direction from one electrical contact to another electrical contact.

19. The method of claim 12 , wherein the extension members move and the plurality of electrical contacts stay substantially in place when the BGA balls are urged into electrical contact engagement with the electrical contact members.

Assignees

• Alcatel Lucent Canada Inc
• Alcatel Lucent

Inventors

• Brown Paul J
• Chan Alex L

Classifications

• H05K7/1084 Primary

  pin grid array package carriers · CPC title

• H05K7/1007 Primary

  with means for increasing contact pressure at the end of engagement of coupling parts · CPC title

• H01R13/639

  Additional means for holding or locking coupling parts together, after engagement, {e.g. separate keylock, retainer strap} · CPC title

• H01R13/62905

  comprising a camming member (H01R13/62933 and H01R13/641 take precedence) · CPC title

• H01R13/15

  Pins, blades or sockets having separate spring member for producing or increasing contact pressure · CPC title