wherein modules are associated together, e.g. electromechanical assemblies, modular structures

wherein modules are associated together, e.g. electromechanical assemblies, modular structures · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH05K5/0065
Official title{wherein modules are associated together, e.g. electromechanical assemblies, modular structures}
Display labelwherein modules are associated together, e.g. electromechanical assemblies, modular structures
Total patents260

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is growing.

Patents filed per year
YearPatents
201511
201618
201717
201818
201919
202045
202115
202219
202338
202430
202522
20268

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H05K5/0065?
CPC H05K5/0065 is the Cooperative Patent Classification code for “wherein modules are associated together, e.g. electromechanical assemblies, modular structures.”
How many patents are filed under CPC H05K5/0065 (wherein modules are associated together, e.g. electromechanical assemblies, modular structures)?
Our database includes 260 publications tagged with this CPC code.
Is patent activity under CPC H05K5/0065 growing?
Publication counts under this code: 30 in 2024 vs 22 in 2025 (latest complete years).