Pressure bulkhead structure with integrated selective electronic switch circuitry, pressure-isolating enclosure containing such selective electronic switch circuitry, and methods of making such

US10161733B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10161733-B2
Application numberUS-201815950453-A
CountryUS
Kind codeB2
Filing dateApr 11, 2018
Priority dateApr 18, 2017
Publication dateDec 25, 2018
Grant dateDec 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

First claim

Opening claim text (preview).

What is claimed is: 1. A pressure bulkhead structure of a perforating gun select fire sub assembly, the pressure bulkhead structure comprising: a pressure-isolating enclosure comprising a pressure-isolating enclosure body having a sealed first end, a sealed second end, and an elongated body portion, wherein the elongated body portion extends between the sealed first end and the sealed second end along a longitudinal direction of the enclosure body; a selective electronic switch circuitry positioned between the sealed first end and the sealed second end of the pressure-isolating enclosure body; an electrical connector extends from the selective electronic switch circuitry through the sealed first end; a wiring arrangement extends from the selective electronic switch circuitry through the sealed second end; and a common ground contact extends from the selective electronic switch circuitry through the sealed second end, wherein the selective electronic switch circuitry is immovable and sealed within the pressure-isolating enclosure body. 2. The pressure bulkhead structure of claim 1 , wherein the electrical connector comprises one of a wire and a pin contact. 3. The pressure bulkhead structure of claim 1 , wherein the pressure-isolating enclosure is formed by one of injection-molding, potting, or 3D-printing, over the selective electronic switch circuitry, such that no manufacturing seams are present within the pressure-isolating enclosure body. 4. The pressure bulkhead structure of claim 1 , wherein the common ground contact comprises one of a ground wire and a plurality of ground arms. 5. A pressure bulkhead structure of a perforating gun select fire sub assembly, the pressure bulkhead structure comprising: a pressure-isolating enclosure comprising a pressure-isolating enclosure body having a sealed first end, a sealed second end, and an elongated body portion, wherein the elongated body portion extends between the sealed first end and the sealed second end along a longitudinal direction of the enclosure body; a selective electronic switch circuitry positioned between the sealed first end and the sealed second end of the pressure-isolating enclosure body; an electrical connector extends from the selective electronic switch circuitry through the sealed first end; a wiring arrangement extends from the selective electronic switch circuitry through the sealed second end; and a plurality of ground arms extend from the selective electronic switch circuitry through the sealed second end, wherein the selective electronic switch circuitry is immovable and sealed within the pressure-isolating enclosure body. 6. The pressure bulkhead structure of claim 5 , wherein the plurality of ground arms comprises: a first ground arm; and a second ground arm, wherein the first and second ground arms are bilaterally spaced apart from each other, the wiring arrangement extends from the selective electronic switch circuitry between the first ground arm and the second ground arm, and the first and second ground arms are each integrally formed with the selective electronic switch circuitry. 7. The pressure bulkhead structure of claim 6 , wherein: the selective electronic switch circuitry comprises an electronic circuit board and electronic switch components affixed to at least one side of the electronic circuit board; and the ground arms are formed by stamping, cutting out, or wet chemically etching a centrally extending section of the electronic circuit board that is devoid of electronic switch components. 8. The pressure bulkhead structure of claim 6 , wherein a contact pad extends from an end of each ground arm, and the contact pad is configured for making electrical connections with corresponding electrically conductive materials positioned outside of the pressure bulkhead structure. 9. The pressure bulkhead structure of claim 8 , wherein the contact pad is glued, snapped, screwed, frictionally affixed, clipped on, or chemically vapor deposed to each ground arm. 10. The pressure bulkhead structure of claim 5 , wherein the electrical connector comprises one of a wire and a pin contact. 11. The pressure bulkhead structure of claim 5 , wherein the selective electronic switch circuitry is immune to RF frequencies, unwanted or stray direct and indirect voltage and current. 12. The pressure bulkhead structure of claim 5 , wherein the pressure-isolating enclosure body is formed about the selective electronic switch circuitry such that there are no spatial gaps between the pressure-isolating enclosure body and the selective electronic switch circuitry. 13. The pressure bulkhead structure of claim 5 , wherein the pressure-isolating enclosure body is formed by one of injection-molding, potting and 3D-printing, over the selective electronic switch circuitry, such that no manufacturing seams are present within the pressure-isolating enclosure body. 14. The pressure bulkhead structure of claim 5 , wherein the pressure-isolating enclosure body further comprises: at least one circumferential groove formed in an outer edge of the pressure-isolating enclosure body; and an O-ring positioned in the at least one circumferential groove. 15. A pressure bulkhead structure for placement in a select fire sub assembly of a perforating gun module, wherein the pressure bulkhead structure forms a pressure isolating chamber between sequential perforating gun modules, the pressure bulkhead structure comprising: an outer pressure-isolating enclosure including a conductive material and having a first end and a second end, the first end surrounding a down hole facing pin assembly, the outer pressure isolating enclosure having an outer wall edge and an inner wall edge, with the inner wall edge defining an interior cavity; an inner pressure-isolating enclosure, the inner pressure-isolating enclosure comprising an inner pressure-isolating body having a sealed first end adjacent the down hole facing pin assembly, an elongated body portion having a longitudinal direction length, the elongated body portion extending between the sealed first end and a sealed second end, the inner pressure-isolating enclosure body further including an outer edge and an inner edge, wherein the outer edge is adjacent the inner wall edge of the outer pressure-isolating enclosure and the entirety of the inner pressure-isolating enclosure body is located within the interior cavity; a selective electronic switch circuitry positioned and sealed within the inner pressure-isolating enclosure body; a pin contact attached to and extending from the selective electronic switch circuitry, and partially extending through the sealed first end so as to make electrical contact with the down hole facing pin assembly located outside the inner pressure-isolating enclosure body; a wiring arrangement attached to and extending from the selective electronic switch circuitry, and partially extending through the sealed second end, so as to provide electrical communication connection between the selective electronic switch circuitry and other components outside of the inner pressure-isolating enclosure body; and a common ground contact attached to and extending from the selective electronic switch circuitry, and partially extending through the sealed second end so as to make electrical contact with conductive material of the outer pressure isolating enclosure, either directly or indirectly. 16. The pressure bulkhead structure of claim 15 , wherein: the second end of the outer pressure-isolating enclosure surrounds a retainer; the sealed second end is adjacent the retainer; and

Assignees

Inventors

Classifications

  • Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

  • wherein modules are associated together, e.g. electromechanical assemblies, modular structures · CPC title

  • characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors · CPC title

  • sealed by potting, e.g. waterproof resin poured in a rigid casing · CPC title

  • F42D1/05Primary

    Electric circuits for blasting · CPC title

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What does patent US10161733B2 cover?
Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a sel…
Who is the assignee on this patent?
Dynaenergetics Gmbh & Co Kg
What technology area does this patent fall under?
Primary CPC classification F42D1/05. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).