Display apparatus and circuit board module thereof

Patent metadata

Field	Value
Publication number	US-9307655-B2
Application number	US-201414321995-A
Country	US
Kind code	B2
Filing date	Jul 2, 2014
Priority date	Jul 4, 2013
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 0<T2−T1≦D.

First claim

What is claimed is:

1. A circuit board module, comprising:
a first circuit board having a supporting surface, the supporting surface having a normal direction, the first circuit board comprising:
an electrically conductive structure disposed on the supporting surface, the electrically conductive structure having a first maximal thickness T1 along the normal direction of the supporting surface;
a first bump disposed on the supporting surface, the first bump having a second maximal thickness T2 along the normal direction of the supporting surface, the first bump having a top surface and a first groove, wherein the top surface is opposite to the supporting surface, and the first groove is disposed on the top surface;
a second circuit board disposed on the electrically conductive structure and the first bump; and
an electrically conductive film disposed between the second circuit board and the electrically conductive structure, the electrically conductive film having a plurality of electrically conductive particles, an average particle diameter D of the electrically conductive particles satisfies: 0<T2−T1≦D when undeformed.

2. The circuit board module of claim 1 , wherein a portion of the second circuit board is received in the first groove.

3. The circuit board module of claim 2 , wherein the first bump has a dented surface positioned in the first groove, and the portion of the second circuit board received in the first groove is against the dented surface.

4. The circuit board module of claim 1 , wherein the first groove has a maximal depth P1 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D.

5. The circuit board module of claim 1 , further comprising:
a second bump disposed on the supporting surface, wherein the second bump has a second groove, wherein the first groove and the second groove respectively have a maximal depth P1 and a maximal depth P2 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D, and the maximal depth P2 satisfies: 0<P2<0.2×D.

6. The circuit board module of claim 1 , further comprising:
a third bump disposed on the supporting surface, wherein the third bump has a third groove, wherein the first groove and the third groove respectively have a maximal depth P1 and a maximal depth P3 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D, and the maximal depth P3 satisfies: P3>0.8×D.

7. The circuit board module of claim 1 , further comprising:
a second bump disposed on the supporting surface, wherein the second bump has a second groove; and
a third bump disposed on the supporting surface, wherein the third bump has a third groove, wherein the first groove, the second groove and the third groove respectively have a maximal depth P1, a maximal depth P2 and a maximal depth P3 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D, the maximal depth P2 satisfies: 0<P2<0.2×D, and the maximal depth P3 satisfies: P3>0.8×D.

8. The circuit board module of claim 1 , further comprising:
a fourth bump disposed on the supporting surface, wherein the fourth bump has a fourth groove, wherein the first bump and the fourth bump are respectively positioned on two opposite sides of the electrically conductive structure.

9. The circuit board module of claim 1 , wherein the difference between the second maximal thickness T2 and the first maximal thickness T1 is substantially equal to the average particle diameter D.

10. A display apparatus, comprising:
a display panel;
a first circuit board;
a second circuit board connecting the display panel and the first circuit board, wherein the first circuit board has a supporting surface, and the supporting surface has a normal direction;
an electrically conductive structure disposed on the supporting surface, the electrically conductive structure having a first maximal thickness T1 along the normal direction of the supporting surface;
a first bump disposed on the supporting surface, the first bump having a second maximal thickness T2 along the normal direction of the supporting surface, the first bump having a top surface and a first groove, wherein the top surface is opposite to the supporting surface, and the first groove is disposed on the top surface; and
an electrically conductive film disposed between the second circuit board and the electrically conductive structure, the electrically conductive film having a plurality of conductive particles, an average particle diameter D of the conductive particles satisfies: 0<T2−T1≦D when undeformed.

11. The display apparatus of claim 10 , wherein a portion of the second circuit board is received in the first groove.

12. The display apparatus of claim 11 , wherein the first bump has a dented surface positioned in the first groove, and the portion of the second circuit board received in the first groove is against the dented surface.

13. The display apparatus of claim 10 , wherein the first groove has a maximal depth P1 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D.

14. The display apparatus of claim 10 , further comprising:
a second bump disposed on the supporting surface, wherein the second bump has a second groove, wherein the first groove and the second groove respectively have a maximal depth P1 and a maximal depth P2 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D, and the maximal depth P2 satisfies: 0<P2<0.2×D.

15. The display apparatus of claim 10 , further comprising:
a third bump disposed on the supporting surface, wherein the third bump has a third groove, wherein the first groove and the third groove respectively have a maximal depth P1 and a maximal depth P3 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D, and the maximal depth P3 satisfies: P3>0.8×D.

16. The display apparatus of claim 10 , further comprising:
a second bump disposed on the supporting surface, wherein the second bump has a second groove; and
a third bump disposed on the supporting surface, wherein the third bump has a third groove, wherein the first groove, the second groove and the third groove respectively have a maximal depth P1, a maximal depth P2 and a maximal depth P3 along the normal direction of the supporting surface, wherein the maximal depth P1 satisfies: 0.2×D≦P1≦0.8×D, the maximal depth P2 satisfies: 0<P2<0.2×D, and the maximal depth P3 satisfies: P3>0.8×D.

17. The display apparatus of claim 10 , further comprising:
a fourth bump disposed on the supporting surface, wherein the fourth bump has a fourth groove, wherein the first bump and the fourth bump are respectively positioned on two opposite sides of the electrically conductive structure.

18. The display apparatus of claim 10 , wherein the difference between the second maximal thickness T2 and the first maximal thickness T1 is substantially equal to the average particle diameter D.

Assignees

• Au Optronics Corp

Inventors

• Chen Chih-Hung
• Huang Po-Fu
• Wang Chih-Hao

Classifications

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K2201/09745

  Recess in conductor, e.g. in pad or in metallic substrate · CPC title

• H05K3/4015

  using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres · CPC title

• H05K2201/09781

  Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components · CPC title

• H05K1/0269

  for visual or optical inspection · CPC title