Injection molded product and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9256334-B2
Application number	US-201314403971-A
Country	US
Kind code	B2
Filing date	May 28, 2013
Priority date	May 30, 2012
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.

First claim

The invention claimed is:

1. An injection molded product comprising:
a base film;
an electrode pattern formed on the base film;
an electrically conductive adhesive formed on an upper surface of the electrode pattern, the electrically conductive adhesive comprising a binder being a thermoplastic resin;
an electrically conductive contact pin having one end which has a bottom face transverse to a longitudinal direction of the electrically conductive contact pin, the electrically conductive adhesive contacting the bottom face and an entire perimeter of the electrically conductive contact pin at the one end of the electrically conductive contact pin, the contact pin being electrically connected to the electrode pattern via the electrically conductive adhesive and arranged to rise from the electrode pattern in the longitudinal direction of the electrically conductive contact pin; and
a molded resin being injection molded along the base film such that the electrically conductive adhesive and a part of the electrically conductive contact pin are embedded in the molded resin and the other end of the electrically conductive contact pin sticks out from the molded resin.

2. The injection molded product according to claim 1 , wherein
the molded resin has a shape along the base film and a constant thickness;
the electrically conductive adhesive is formed such that a portion where the electrically conductive contact pin rises is in a shape of a mountain; and
a height of the electrically conductive adhesive from an upper surface of the electrode pattern to a mountain peak of the electrically conductive adhesive is in the range of 3%-30% of the thickness of the molded resin.

3. The injection molded product according to claim 1 ,
wherein
a pin surface of the electrically conductive contact pin is provided with a matted unevenness.

4. The injection molded product according to claim 1 , wherein
a pin surface of the electrically conductive contact pin is provided with an annular knurled groove.

5. The injection molded product according to claim 1 , wherein
a pin tip of the electrically conductive contact pin in contact with the electrically conductive adhesive is provided with a tapered part.

6. The injection molded product according to claim 1 ,
wherein
the electrically conductive contact pin comprises a pin tip part where the pin tip, in contact with the electrically conductive adhesive, is enlarged in a radial direction.

7. The electronic apparatus, wherein the injection molded product according to claim 1 is used.

8. The injection molded product according to claim 1 , wherein
the electrically conductive contact pin has a plurality of longitudinal faces each extending in the longitudinal direction of the electrically conductive contact pin, and a portion of each of the plurality of longitudinal faces at the one end of the electrically conductive contact pin form the entire perimeter of the electrically conductive contact pin at the one end.

9. The injection molded product according to claim 8 , wherein the electrically conductive contact pin has four longitudinal faces that form the electrically conductive contact pin as a rectangularly shaped electrically conductive contact pin.

10. A injection molded product comprising:
a base film:
an electrode pattern formed on the base film;
an electrically conductive adhesive formed on an upper surface of the electrode pattern, the electrically conductive adhesive comprising a binder being a thermoplastic resin;
an electrically conductive contact pin having one end contacted with the electrically conductive adhesive, the electrically conductive contact pin being electrically connected to the electrode pattern via the electrically conductive adhesive and arranged to rise from the electrode pattern, and the contact pin comprising:
an annular knurled groove, which is provided diagonally to pin axial direction on a pin surface; and
an concave-convex part, which is provided on a circumferential part of a pin tip in contact with the electrically conductive adhesive, the concave-convex part being formed as a result of the arrangement of the knurled groove; and

a molded resin being injection molded along the base film such that the electrically conductive adhesive and a part of the electrically conductive contact pin are embedded in the molded resin and the other end of the electrically conductive contact pin sticks out from the molded resin.

11. A injection molded product comprising:
a base film;
an electrode pattern formed on the base film;
an electrically conductive adhesive formed on an upper surface of the electrode pattern, the electrically conductive adhesive comprising a binder being a thermoplastic resin;
an electrically conductive contact pin having one end contacted with the electrically conductive adhesive, the electrically conductive contact pin being electrically connected to the electrode pattern via the electrically conductive adhesive and arranged to rise from the electrode pattern; and
a molded resin being injection molded along the base film such that the electrically conductive adhesive and a part of the electrically conductive contact pin are embedded in the molded resin and the other end of the electrically conductive contact pin sticks out from the molded resin;
the electrically conductive contact pin having a flat plate shape, and an opening or a notch is formed in the portion of the contact pin embedded in the molded resin.

12. An injection molded product comprising:
a base film;
an electrode pattern formed on the base film;
an electrically conductive adhesive formed on an upper surface of the electrode pattern, the electrically conductive adhesive comprising a binder being a thermoplastic resin;
an electrically conductive contact pin having one end contacted with the electrically conductive adhesive, the electrically conductive contact pin being electrically connected to the electrode pattern via the electrically conductive adhesive and arranged to rise from the electrode pattern;
a molded resin being injection molded along the base film such that the electrically conductive adhesive and a part of the electrically conductive contact pin are embedded in the molded resin and the other end of the electrically conductive contact pin sticks out from the molded resin; and
a reinforcing member formed along an outer perimetric surface of the electrically conductive contact pin, rising integrally from the upper surface of the molded resin.

13. The injection molded product manufacturing method comprising:
preparing an injection molding mold that includes a fixed mold and a movable mold, contactable with the fixed mold;
mounting, on an inner surface of the movable mold, a base film whereon an electrode pattern and an electrically conductive adhesive comprising a binder being a thermoplastic resin are provided on the electrode pattern;
disposing, on an inner surface of the fixed mold, a contact pin that is electrically conductive, such that the contact pin is arranged to rise from the inner surface of the fixed mold;
closing the movable mold and the fixed mold such that the electrically conductive adhesive and the contact pin are in contact;
forming a molded resin by injecting a resin melt into a cavity part formed between the movable mold and the fixed mold, softening the electrically conductive adhesive by the heat of the resin melt, bringing the surfaces of the electrically conductive adhesive and the contact pin into close contact with the resin melt, and cooling and solidifying such; and
opening the fixed mold and the movable mold and ejecting the injection molded prod

Assignees

• Nissha Printing

Inventors

• Yamazaki Seiichi
• Higashikawa Toshihiro
• Matsuzaki Tomohiro
• Kariya Masahiko

Classifications

• H05K1/0284

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• B29C2045/14114

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• H01R4/04

  using electrically conductive adhesives · CPC title

• G06F2203/04112

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