A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
by microetching
by microetching · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/383 |
| Official title | {by microetching} |
| Display label | by microetching |
| Total patents | 88 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 12 |
| 2017 | 9 |
| 2018 | 8 |
| 2019 | 4 |
| 2020 | 4 |
| 2021 | 5 |
| 2022 | 9 |
| 2023 | 4 |
| 2024 | 9 |
| 2025 | 7 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Sensing electrode
US-2022341870-A1 · Oct 27, 2022 · US
Apparatus with a substrate provided with plasma treatment
US-11291122-B2 · Mar 29, 2022 · US
Bonded substrate and manufacturing method of bonded substrate
US-2022030708-A1 · Jan 27, 2022 · US
Method of manufacturing the printed board
US-11229123-B2 · Jan 18, 2022 · US
Aqueous solution for surface treatment, method for producing surface-treated alloy, and composite and method for producing the same
US-2021381111-A1 · Dec 9, 2021 · US
Surface-treated copper foil, and copper-clad laminate and circuit board using same
US-2021212204-A1 · Jul 8, 2021 · US
Method of manufacturing wiring board
US-11001930-B2 · May 11, 2021 · US
High-speed interconnects for printed circuit boards
US-10993331-B2 · Apr 27, 2021 · US
Method for manufacturing wiring board, and wiring board
US-2021084774-A1 · Mar 18, 2021 · US
Method of manufacturing wiring board
US-2020413545-A1 · Dec 31, 2020 · US
Wiring board and manufacturing method of the wiring board
US-2020404781-A1 · Dec 24, 2020 · US
Apparatus with a substrate provided with plasma treatment
US-2020245472-A1 · Jul 30, 2020 · US
Etching solution for copper and copper alloy surfaces
US-10619251-B2 · Apr 14, 2020 · US
Non-roughened cu trace with anchoring to reduce insertion loss of high speed io routing in package substrate
US-2019295937-A1 · Sep 26, 2019 · US
Wiring substrate and semiconductor device
US-10366949-B2 · Jul 30, 2019 · US
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
US-10219391-B2 · Feb 26, 2019 · US
Etching solution for copper and copper alloy surfaces
US-2019003061-A1 · Jan 3, 2019 · US
High-speed interconnects for printed circuit boards
US-2018332720-A1 · Nov 15, 2018 · US
Surface treatment agent for copper and copper alloy surfaces and method for treating copper or copper alloy surfaces
US-2018312978-A1 · Nov 1, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/383?
- CPC H05K3/383 is the Cooperative Patent Classification code for “by microetching.”
- How many patents are filed under CPC H05K3/383 (by microetching)?
- Our database includes 88 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/383 growing?
- Publication counts under this code: 9 in 2024 vs 7 in 2025 (latest complete years).