Stretchable mounting board

Patent metadata

Field	Value
Publication number	US-11212915-B2
Application number	US-202017070499-A
Country	US
Kind code	B2
Filing date	Oct 14, 2020
Priority date	Mar 29, 2019
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A stretchable mounting board that includes a mounting electrode section electrically connected to stretchable wiring, and solder electrically connected to the mounting electrode section. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

First claim

The invention claimed is:

1. A stretchable mounting board comprising:
a stretchable substrate having a main surface;
a stretchable wiring disposed on the main surface of the stretchable substrate;
a mounting electrode section electrically connected to the stretchable wiring;
solder electrically connected to the mounting electrode section and including bismuth and tin; and
an electronic component electrically connected to the mounting electrode section with the solder interposed between the electronic component and the mounting electrode,
wherein
the mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin, and
a concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

2. The stretchable mounting board according to claim 1 , wherein the mounting electrode section further includes silver and a resin.

3. The stretchable mounting board according to claim 2 , wherein the resin includes at least one resin selected from an epoxy resin, a urethane resin, an acrylic resin, a silicone resin, and a polyester resin.

4. The stretchable mounting board according to claim 1 , wherein a bismuth eutectic size in the second electrode layer is larger than a bismuth eutectic size in the first electrode layer.

5. The stretchable mounting board according to claim 4 , wherein the bismuth eutectic size in the second electrode layer is 1 μm or more.

6. The stretchable mounting board according to claim 1 , wherein the first electrode layer has a thickness of 5 μm or more.

7. The stretchable mounting board according to claim 1 , wherein the second electrode layer has a thickness of 5 μm or more.

8. The stretchable mounting board according to claim 1 , wherein a length of the first electrode layer is larger than a length of the second electrode layer.

9. The stretchable mounting board according to claim 1 , wherein a length of the mounting electrode section is larger than a length of the solder.

10. The stretchable mounting board according to claim 1 , wherein the stretchable wiring includes a mixture of conductive particles and a resin.

11. The stretchable mounting board according to claim 10 , wherein the conductive particles are selected from silver, copper and nickel.

12. The stretchable mounting board according to claim 1 , wherein the stretchable wiring includes silver and a resin.

13. The stretchable mounting board according to claim 12 , wherein the resin includes at least one resin selected from an epoxy resin, a urethane resin, an acrylic resin, and a silicone resin.

14. The stretchable mounting board according to claim 1 , wherein the stretchable substrate includes at least one resin selected from a silicone resin, an acrylic resin, an olefin resin, and a urethane resin.

15. A stretchable mounting board comprising:
a stretchable substrate having a main surface;
a stretchable wiring disposed on the main surface of the stretchable substrate;
a first electrode layer electrically connected to the stretchable wiring, the first electrode layer including bismuth and tin; and
a second electrode layer on the first electrode layer and arranged such that the first electrode layer is between the second electrode layer and the stretchable wiring, the second electrode layer including bismuth and tin, wherein
a concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

16. The stretchable mounting board according to claim 15 , wherein a bismuth eutectic size in the second electrode layer is larger than a bismuth eutectic size in the first electrode layer.

17. The stretchable mounting board according to claim 16 , wherein the bismuth eutectic size in the second electrode layer is 1 μm or more.

18. The stretchable mounting board according to claim 15 , wherein the first electrode layer has a thickness of 5 μm or more.

19. The stretchable mounting board according to claim 15 , wherein the second electrode layer has a thickness of 5 μm or more.

20. The stretchable mounting board according to claim 15 , wherein a length of the first electrode layer is larger than a length of the second electrode layer.

Assignees

• Murata Manufacturing Co

Inventors

• Katsu Hayato
• Nishida Keisuke
• Asai Ryo
• Okada Takayuki
• Tani Shinsuke

Classifications

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• H05K2201/0269

  Non-uniform distribution or concentration of particles · CPC title

• H05K2201/0379

  Stacked conductors · CPC title

• H05K2201/035

  Paste overlayer, i.e. conductive paste or solder paste over conductive layer · CPC title

• H05K2201/0266

  Size distribution · CPC title