Prelaminate for an electronic card, and methods for producing such a prelaminate and an electronic card comprising such a prelaminate

US11599764B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11599764-B2
Application numberUS-202117192307-A
CountryUS
Kind codeB2
Filing dateMar 4, 2021
Priority dateMar 6, 2020
Publication dateMar 7, 2023
Grant dateMar 7, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a prelaminate for an electronic card, wherein at least a first group of pads is formed from a metal plate formed from a piece comprising a central part and branches extending from the central part, the branches of the metal plate forming the pads of the first group. The invention also relates to a method for producing such a prelaminate and an electronic card comprising such a prelaminate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A prelaminate for an electronic card, the prelaminate comprising: at least two substrates; at least a first group of pads assembled between the two substrates; and a metal plate formed from a piece comprising a central part, and at least two branches which extend from the central part, the at least two branches of the metal plate forming the pads of the first group, a first of the at least two branches being perpendicular to a second of the at least two branches. 2. The prelaminate according to claim 1 , further comprising at least a second group of pads, at least one of the pads of the second group ( 31 ) being connected to one of the branches of the metal plate by a bonding wire. 3. The prelaminate according to claim 2 , further comprising a second metal plate formed from a piece comprising a central part, and branches extending from the central part ( 11 ), the branches of the second metal plate forming the pads of the second group. 4. The prelaminate according to claim 1 , further comprising an antenna having two ends, the two ends of the antenna being connected to two of the branches of the metal plate of the first group. 5. The prelaminate according to claim 1 , wherein the at least two branches include at least a first set of branches extending perpendicular to a second set of branches. 6. The method according to claim 1 , wherein the at least two branches that are provided include at least a first set of branches extending perpendicular to a second set of branches. 7. A method for producing a prelaminate, the method comprising: providing at least two substrates; providing a metal plate formed from a piece comprising a central part and at least two branches extending from the central part, the at least two branches forming a first group of pads, a first of the at least two branches being perpendicular to a second of the at least two branches; positioning the metal plate in relation to at least a first substrate of the two substrates; and laminating the at least two substrates, the metal plate being between the two substrates. 8. The method according to claim 7 , wherein the positioning the metal plate with at least the first substrate of the two substrates comprises embedding the metal plate in the first substrate. 9. The method according to claim 7 , further comprising: providing a second group of pads; and connecting at least one of the pads of the second group to one of the branches of the metal plate by a bonding wire. 10. The method according to claim 7 , further comprising: providing an antenna having two ends; and connecting the two ends of the antenna to two of the branches of the metal plate. 11. A method for producing an electronic card, the method comprising: the method for producing the prelaminate according to claim 7 ; and machining comprising removing the central part of the metal plate of the first group of pads, and stripping at least one of the branches of the metal plate forming one of the pads of the first group. 12. The method according to claim 11 , further comprising: providing two cover layers; and laminating the prelaminate between the two cover layers arranged on either side of the prelaminate. 13. The method according to claim 11 , wherein the machining further comprises: removing a central part of a metal plate forming a second group of pads, and stripping at least one pad of the second group. 14. The method according to claim 11 , further comprising inserting and connecting a first module to the pads of the first group.

Assignees

Inventors

Classifications

  • Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH · CPC title

  • by using a moving tool for milling or cutting the conductive material · CPC title

  • Printed circuits associated with mounted high frequency components · CPC title

  • Organic insulating material · CPC title

  • with surface mounted components (H05K3/32 takes precedence) · CPC title

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Frequently asked questions

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What does patent US11599764B2 cover?
The present invention relates to a prelaminate for an electronic card, wherein at least a first group of pads is formed from a metal plate formed from a piece comprising a central part and branches extending from the central part, the branches of the metal plate forming the pads of the first group. The invention also relates to a method for producing such a prelaminate and an electronic card co…
Who is the assignee on this patent?
Idemia France
What technology area does this patent fall under?
Primary CPC classification H05K3/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).