Polypeptide, photoresist composition including the same, and method of forming pattern using the same
US-12441769-B2 · Oct 14, 2025 · US
characterised by the composition of the mask
characterised by the composition of the mask · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/0076 |
| Official title | {characterised by the composition of the mask} |
| Display label | characterised by the composition of the mask |
| Total patents | 68 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 11 |
| 2017 | 8 |
| 2018 | 2 |
| 2019 | 2 |
| 2020 | 4 |
| 2021 | 5 |
| 2022 | 2 |
| 2023 | 7 |
| 2024 | 3 |
| 2025 | 6 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Selective removal of adhesive from coverlay for printed circuit board insulation
US-2025227837-A1 · Jul 10, 2025 · US
Photosensitive film and method for forming permanent mask resist
US-12032292-B2 · Jul 9, 2024 · US
Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method
US-11921424-B2 · Mar 5, 2024 · US
Method for producing wiring board, and wiring board
US-2024015889-A1 · Jan 11, 2024 · US
Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method
US-2023350292-A1 · Nov 2, 2023 · US
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
US-2023288802-A1 · Sep 14, 2023 · US
Wiring substrate, semiconductor device, and method of manufacturing wiring substrate
US-2023230911-A1 · Jul 20, 2023 · US
Multilayer substrate and manufacturing method therefor
US-2023199957-A1 · Jun 22, 2023 · US
Polypeptide, photoresist composition including the same, and method of forming pattern using the same
US-2023183294-A1 · Jun 15, 2023 · US
Method for producing laminate having patterned metal foil, and laminate having patterned metal foil
US-11664240-B2 · May 30, 2023 · US
Method of Manufacturing Printed Circuit Boards
US-2023159779-A1 · May 25, 2023 · US
Photopolymer for anti-yellowing and anti-thermal cracking applications
US-2022289884-A1 · Sep 15, 2022 · US
Photosensitive composition and photoresist dry film made therefrom
US-2022252980-A1 · Aug 11, 2022 · US
High temperature resistant masking adhesive composition
US-11203704-B2 · Dec 21, 2021 · US
Solder mask inkjet inks for manufacturing printed circuit boards
US-11098215-B2 · Aug 24, 2021 · US
Photosensitive film and method for forming permanent mask resist
US-2021124267-A1 · Apr 29, 2021 · US
Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method
US-2021109444-A1 · Apr 15, 2021 · US
High temperature resistant masking adhesive composition
US-2021032513-A1 · Feb 4, 2021 · US
Method for producing laminate having patterned metal foil, and laminate having patterned metal foil
US-2020388506-A1 · Dec 10, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/0076?
- CPC H05K3/0076 is the Cooperative Patent Classification code for “characterised by the composition of the mask.”
- How many patents are filed under CPC H05K3/0076 (characterised by the composition of the mask)?
- Our database includes 68 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/0076 growing?
- Publication counts under this code: 3 in 2024 vs 6 in 2025 (latest complete years).