Substrate and method for manufacturing the same
US-2018242453-A1 · Aug 23, 2018 · US
combined with laser drilling through a metal layer
combined with laser drilling through a metal layer · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/0038 |
| Official title | {combined with laser drilling through a metal layer} |
| Display label | combined with laser drilling through a metal layer |
| Total patents | 173 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 20 |
| 2016 | 15 |
| 2017 | 14 |
| 2018 | 16 |
| 2019 | 18 |
| 2020 | 16 |
| 2021 | 28 |
| 2022 | 12 |
| 2023 | 16 |
| 2024 | 11 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package substrate
US-2018235085-A1 · Aug 16, 2018 · US
Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
US-10032646-B2 · Jul 24, 2018 · US
Flexible circuit board having enhanced bending durability and method for preparing same
US-2018206335-A1 · Jul 19, 2018 · US
Wiring substrate and semiconductor package
US-10028393-B2 · Jul 17, 2018 · US
Method of manufacturing a package substrate
US-9992873-B2 · Jun 5, 2018 · US
Printed circuit board and methods to enhance reliability
US-2018139852-A1 · May 17, 2018 · US
Printed board, light emitting device, and method for manufacturing same
US-2018097164-A1 · Apr 5, 2018 · US
Method of manufacturing the printed board
US-2018098434-A1 · Apr 5, 2018 · US
Method for manufacturing multilayer wiring board
US-2018084651-A1 · Mar 22, 2018 · US
Wiring board and mounting structure using same
US-9877387-B2 · Jan 23, 2018 · US
Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards
US-9832865-B2 · Nov 28, 2017 · US
Flexible printed circuit board and method for producing the same
US-2017318674-A1 · Nov 2, 2017 · US
Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards
US-2017311444-A1 · Oct 26, 2017 · US
Wiring board with stacked embedded capacitors and method of making
US-9743526-B1 · Aug 22, 2017 · US
Wiring board with built-in electronic component and method for manufacturing the same
US-9743534-B2 · Aug 22, 2017 · US
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
US-2017231092-A1 · Aug 10, 2017 · US
Wiring board with stacked embedded capacitors and method of making
US-2017231094-A1 · Aug 10, 2017 · US
Printed wiring board
US-2017196084-A1 · Jul 6, 2017 · US
Tape carrier package, method of manufacturing the same and chip package
US-9674955-B2 · Jun 6, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/0038?
- CPC H05K3/0038 is the Cooperative Patent Classification code for “combined with laser drilling through a metal layer.”
- How many patents are filed under CPC H05K3/0038 (combined with laser drilling through a metal layer)?
- Our database includes 173 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/0038 growing?
- Publication counts under this code: 11 in 2024 vs 6 in 2025 (latest complete years).