Wiring board with built-in electronic component and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9743534-B2
Application number	US-201514878072-A
Country	US
Kind code	B2
Filing date	Oct 8, 2015
Priority date	Oct 8, 2014
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity.

First claim

What is claimed is:

1. A wiring board with a built-in electronic component, comprising:
a substrate having a cavity;
an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate;
a conductor layer formed on the interlayer insulating layer;
an electronic component accommodated in the cavity of the substrate and comprising a rectangular cuboid body and a plurality of terminal electrodes such that each of the terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body; and
a plurality of via conductors formed in the interlayer insulating layer such that the plurality of via conductors is connecting the conductor layer and the terminal electrodes of the electronic component,
wherein the electronic component has the terminal electrodes arrayed in a matrix comprising a plurality of rows and a plurality of columns on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes in a row direction and in a column direction have opposite polarities, the conductor layer comprises a line pattern shunting a first group of the terminal electrodes in one polarity and a solid pattern shunting a second group of the terminal electrodes in the other polarity such that the solid pattern is insulated from the line pattern, the plurality of terminal electrodes is arrayed in the matrix comprising two rows and at least three columns on the outer surface of the rectangular cuboid body, the conductor layer comprises a plurality of electrode opposing portions arrayed in a plurality of rows facing the terminal electrodes arrayed in the matrix across the interlayer insulating layer such that the plurality of via conductors is connecting the electrode opposing portions of the conductor layer and the terminal electrodes of the electronic component, the line pattern of the conductor layer has a triangle wave line pattern facing the first group of the terminal electrodes and connecting a group of the via conductors formed in a zigzag pattern, and the solid pattern of the conductor layer has a frame pattern surrounding the electrode opposing portions and the line pattern and connecting to the second group of the terminal electrodes.

2. A wiring board with a built-in electronic component according to claim 1 , further comprising:
a second interlayer insulating layer formed on an opposite side of the substrate with respect to the interlayer insulating layer such that the interlayer insulating layer is covering the cavity of the substrate;
a second conductor layer formed on the second interlayer insulating layer; and
a plurality of second via conductors formed in the second interlayer insulating layer,
wherein the substrate has the cavity penetrating through the substrate, the electronic component comprises a plurality of second terminal electrodes such that each of the second terminal electrodes has a metal film form formed on a second outer surface of the rectangular cuboid body on an opposite side with respect to the outer surface, the plurality of second via conductors is connecting the second conductor layer and the second terminal electrodes of the electronic component, the electronic component has the second terminal electrodes arrayed in a matrix comprising a plurality of rows and a plurality of columns on the second outer surface of the rectangular cuboid body such that adjacent second terminal electrodes in a row direction and in a column direction have opposite polarities, and the second conductor layer comprises a line pattern shunting a first group of the second terminal electrodes in one polarity and a solid pattern shunting a second group of the second terminal electrodes in the other polarity such that the solid pattern is insulated from the line pattern.

3. A wiring board with a built-in electronic component according to claim 1 , further comprising:
a frame-shaped conductor pattern formed on a surface of the substrate such that a shortest distance between the first group of the terminal electrodes and an inner edge of the frame-shaped conductor pattern is formed greater than a shortest distance between the second group of the terminal electrodes and the inner edge of the frame-shaped conductor pattern.

4. A wiring board with a built-in electronic component according to claim 1 , wherein the solid pattern of the conductor layer is forming ground, and the line pattern of the conductor layer is forming one of a power source line and a signal line.

5. A wiring board with a built-in electronic component according to claim 1 , wherein the electronic component is a multilayer ceramic capacitor.

6. A wiring board with a built-in electronic component according to claim 2 , further comprising:
a frame-shaped conductor pattern formed on a surface of the substrate such that a shortest distance between the first group of the terminal electrodes and an inner edge of the frame-shaped conductor pattern is formed greater than a shortest distance between the second group of the terminal electrodes and the inner edge of the frame-shaped conductor pattern.

7. A wiring board with a built-in electronic component according to claim 2 , wherein the solid pattern of the conductor layer is forming ground, and the line pattern of the conductor layer is forming one of a power source line and a signal line.

8. A wiring board with a built-in electronic component according claim 2 , wherein the electronic component is a multilayer ceramic capacitor.

9. A wiring board with a built-in electronic component according to claim 3 , wherein the solid pattern of the conductor layer is forming ground, and the line pattern of the conductor layer is forming one of a power source line and a signal line.

10. A wiring board with a built-in electronic component according claim 3 , wherein the electronic component is a multilayer ceramic capacitor.

11. A method for manufacturing a wiring board with a built-in electronic component, comprising:
forming a cavity in a substrate;
positioning in the cavity of the substrate an electronic component comprising a rectangular cuboid body and a plurality of terminal electrodes such that each of the terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body;
forming an interlayer insulating layer on the substrate such that the interlayer insulating layer covers the cavity of the substrate;
forming a conductor layer on the interlayer insulating layer; and
forming a plurality of via conductors formed in the interlayer insulating layer such that the plurality of via conductors is connecting the conductor layer and the terminal electrodes of the electronic component,
wherein the electronic component has the terminal electrodes arrayed in a matrix comprising a plurality of rows and a plurality of columns on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes in a row direction and in a column direction have opposite polarities, the forming of the conductor layer comprises forming a line pattern shunting a first group of the terminal electrodes in one polarity and forming a solid pattern shunting a second group of the terminal electrodes in the other polarity such that the solid pattern is insulated from the line pattern, the plurality of terminal electrodes is arrayed in the matrix comprising two rows and at least three columns on the outer surface of the rectangular cuboid body, the forming of the conductor layer comprises forming a plurality of electrode opposing portions arrayed in a plurality of rows facing the terminal electrodes arrayed in the matrix across the interlayer insulating layer such that the

Assignees

• Ibiden Co Ltd

Inventors

• Tomikawa Mitsuhiro
• Noda Kota
• Kuroda Nobuhisa
• Morita Haruhiko

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/728

  between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title