Strain sensing element, having a first and second magnetic layer and a third layer that is antiferrimagnetic
US-10448845-B2 · Oct 22, 2019 · US
using solid state devices (solid state devices per se H10)
using solid state devices (solid state devices per se H10) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H04R23/006 |
| Official title | {using solid state devices (solid state devices per se H10)} |
| Display label | using solid state devices (solid state devices per se H10) |
| Total patents | 88 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 11 |
| 2017 | 17 |
| 2018 | 11 |
| 2019 | 10 |
| 2020 | 15 |
| 2021 | 3 |
| 2022 | 6 |
| 2023 | 3 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Mems device and process
US-2019306630-A1 · Oct 3, 2019 · US
A strain sensing element, having a first and second magnetic layer and a third layer that is antiferrimagnetic
US-2019239760-A9 · Aug 8, 2019 · US
MEMS device and process
US-10375481-B2 · Aug 6, 2019 · US
Directional microphone
US-2019200119-A1 · Jun 27, 2019 · US
Diaphragm element arrangement and related method
US-2019149926-A1 · May 16, 2019 · US
Audio sensing device and method of acquiring frequency information
US-10225662-B2 · Mar 5, 2019 · US
Transistor acoustic sensor element and method for manufacturing the same, acoustic sensor and portable device
US-2019067608-A1 · Feb 28, 2019 · US
Microelectromechanical microphone
US-2019058936-A1 · Feb 21, 2019 · US
Mems devices and processes
US-2019047847-A1 · Feb 14, 2019 · US
MEMS Sound Transducer, MEMS Microphone and Method for Providing a MEMS Sound Transducer
US-2018352337-A1 · Dec 6, 2018 · US
Microphone and manufacture thereof
US-2018279031-A1 · Sep 27, 2018 · US
In-the-ear automatic-noise-reduction devices, assemblies, components, and methods
US-10021478-B2 · Jul 10, 2018 · US
Optical microphone system
US-9992581-B2 · Jun 5, 2018 · US
MEMS microphone with low pressure region between diaphragm and counter electrode
US-9986344-B2 · May 29, 2018 · US
Display panel and preparation method therefor, and display device and health monitoring method thereof
US-9961427-B2 · May 1, 2018 · US
Micro-electro-mechanical acoustic transducer device with improved detection features and corresponding electronic apparatus
US-2018103326-A1 · Apr 12, 2018 · US
MEMS component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection
US-9936298-B2 · Apr 3, 2018 · US
Absolute sensitivity of a MEMS microphone with capacitive and piezoelectric electrodes
US-9894453-B2 · Feb 13, 2018 · US
In-the-ear automatic-noise-reduction devices, assemblies, components, and methods
US-2018020281-A1 · Jan 18, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H04R23/006?
- CPC H04R23/006 is the Cooperative Patent Classification code for “using solid state devices (solid state devices per se H10).”
- How many patents are filed under CPC H04R23/006 (using solid state devices (solid state devices per se H10))?
- Our database includes 88 publications tagged with this CPC code.
- Is patent activity under CPC H04R23/006 growing?
- Publication counts under this code: 3 in 2023 vs 1 in 2025 (latest complete years).