Magnetically coupled galvanically isolated communication using lead frame

Patent metadata

Field	Value
Publication number	US-9331004-B2
Application number	US-201514688257-A
Country	US
Kind code	B2
Filing date	Apr 16, 2015
Priority date	Nov 14, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within the encapsulation. The lead frame includes a first conductor forming a first conductive loop. A second conductor is galvanically isolated from the first conductor. The second conductor forms a second conductive loop proximate to and magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors. A signal that is transmitted from a transmit circuit coupled to the first conductor is coupled to be received through the magnetic communication link by a receive circuit coupled to the second conductor.

First claim

What is claimed is:

1. An integrated circuit package, comprising:
an encapsulation; and
a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including:
a first conductor forming a first conductive loop;
a second conductor galvanically isolated from the first conductor, wherein the second conductor forms a second conductive loop proximate to and magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors, wherein a signal transmitted from a transmit circuit coupled to the first conductor is received through the magnetic communication link by a receive circuit coupled to the second conductor; and
a first bond wire disposed within the encapsulation and coupling together portions of the first conductive loop.

2. The integrated circuit package of claim 1 wherein the transmit circuit is coupled to transmit a transmitter current having rising and falling slopes to induce a pulsating voltage coupled to be received by the receive circuit.

3. The integrated circuit package of claim 2 wherein an amplitude of the pulsating voltage is positive during a rising time of the transmitter current, and wherein the amplitude of the pulsating voltage is negative during a falling time of the transmitter current, wherein the receive circuit includes a comparator coupled to be responsive to the amplitude of the pulsating voltage.

4. The integrated circuit package of claim 1 further comprising a second bond wire disposed within the encapsulation and coupling together portions of the second conductive loop.

5. The integrated circuit package of claim 1 wherein magnetically coupled portions of the first and second conductive loops are disposed substantially in a same plane.

6. The integrated circuit package of claim 1 wherein the first and second conductive loops each consist of one turn.

7. The integrated circuit package of claim 1 wherein substantial portions of the first and second conductive loops are encapsulated in a molded non-ferrous insulating material.

8. The integrated circuit package of claim 1 wherein the receive circuit is disposed within the integrated circuit package, and wherein the receive circuit is coupled to and completes the first conductive loop.

9. The integrated circuit package of claim 1 wherein the receive circuit is included in a first integrated circuit die disposed within the integrated circuit package, wherein the first integrated circuit die is coupled to and completes the first conductive loop.

10. The integrated circuit package of claim 1 wherein the receive circuit is included in a first integrated circuit die mounted on the lead frame, wherein the first integrated circuit die is coupled to and completes the first conductive loop.

11. The integrated circuit package of claim 1 wherein the transmit circuit is disposed within the integrated circuit package, and wherein the transmit circuit is coupled to the second conductive loop.

12. The integrated circuit package of claim 11 wherein the transmit circuit is included in a second integrated circuit die disposed within the integrated circuit package, wherein the second integrated circuit die is coupled to the second conductive loop.

13. The integrated circuit package of claim 11 wherein the transmit circuit is included in a second integrated circuit die mounted on the lead frame, wherein the second integrated circuit die is coupled to the second conductive loop.

14. The integrated circuit package of claim 1 further comprising a first transceiver circuit disposed within the integrated circuit package, wherein the first transceiver circuit includes the transmit circuit coupled to the first conductive loop, wherein the integrated circuit package further comprises a second transceiver circuit disposed within the integrated circuit package, wherein the second transceiver circuit includes the receive circuit coupled to the second conductive loop.

15. The integrated circuit package of claim 1 wherein the first conductor is coupled to a first reference ground and wherein the second conductor is coupled to a second reference ground, wherein the first reference ground and the second reference ground are electrically isolated from one another.

Assignees

• Power Integrations Inc

Inventors

• Balakrishnan Balu
• Matthews David Michael Hugh

Classifications

• H10W90/293

  characterised by non-galvanic coupling between the chips, e.g. capacitive coupling · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title