Mounting layer for cooling structure

Patent metadata

Field	Value
Publication number	US-9515453-B2
Application number	US-201414889705-A
Country	US
Kind code	B2
Filing date	May 7, 2014
Priority date	May 8, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

The invention describes a mounting layer ( 200 ) for mounting at least two light emitting semiconductor devices. The mounting layer ( 200 ) comprises corner protrusion ( 205 ) and edge protrusion ( 210 ) for aligning the mounting layer ( 200 ) to the cooling structure ( 100 ). The mounting layer ( 200 ) further comprises aligning holes ( 215 ) defining mounting areas ( 270 ) for mounting the light emitting semiconductor devices. The mounting layer ( 200 ) enables, for example, manufacturing of a μ-channel cooler with mounting areas ( 270 ) by means of one direct bonding process. Tolerances may thus be reduced. The invention further describes a cooling structure ( 100 ) like a μ-channel cooler comprising such a mounting layer ( 200 ) and a light emitting structure comprising such a cooling structure ( 100 ). Furthermore, methods of manufacturing such a mounting layer ( 200 ), cooling structure ( 100 ) and light emitting structure are described.

First claim

The invention claimed is:

1. A mounting layer for mounting at least two light emitting semiconductor devices, the mounting layer comprising a sheet of material, the mounting layer further comprising a corner protrusion and an edge protrusion for aligning the mounting layer to a cooling structure, the mounting layer further comprising aligning holes defining mounting areas for mounting the light emitting semiconductor device, the material being configured to be directly bonded or welded to the cooling structure.

2. The mounting layer according to claim 1 , wherein the material of the mounting layer or a coating on top of the mounting layer is suitable for solder bonding of the light emitting semiconductor devices.

3. The mounting layer according to claim 1 , wherein the material of the mounting layer is characterized by thermal conductivity above 10 W/(m*K).

4. The mounting layer according to claim 1 , wherein the mounting layer has a thickness between 50 μm and 600 μm.

5. The mounting layer according to claim 2 , the mounting layer further comprising a barrier solder reservoir being arranged in a way that spilling of excess solder between adjacent mounting areas is reduced.

6. The mounting layer according to claim 2 , the mounting layer further comprising a solder reservoir being arranged in the area of the mounting areas.

7. A cooling structure comprising a cooling body bonded to the mounting layer according to claim 1 .

8. The cooling structure according to claim 7 being a μ-channel cooler.

9. A light emitting structure comprising the cooling structure according to claim 7 and at least two light emitting semiconductor devices.

10. The light emitting structure according to claim 9 , wherein the light emitting semiconductor devices are semiconductor lasers.

11. A method of manufacturing a mounting layer for mounting a light emitting semiconductor device, the method comprising the steps of
providing a sheet of material, the material being configured to be directly bonded or welded to a cooling structure,
providing corner protrusion and edge protrusion in the sheet of material for aligning the mounting layer to a cooling body of the cooling structure, and
providing aligning holes defining mounting areas in the sheet of material for mounting the light emitting semiconductor device.

12. The method according to claim 11 comprising the further step of providing a barrier solder reservoir in the sheet of material being arranged in a way that spilling of excess solder between adjacent mounting areas is reduced.

13. The method according to claim 11 comprising the further step of providing a solder reservoir being arranged in the area of the mounting areas.

14. A method of manufacturing a cooling structure comprising the steps of
providing a cooling body, and
bonding a mounting layer according to claim 1 to the cooling body.

15. A method of manufacturing a light emitting structure comprising the steps of
providing the cooling structure according to claim 7 , and
attaching on mounting areas at least two light emitting semiconductor devices.

Assignees

• Koninklijke Philips Nv

Inventors

• Pollmann-Retsch Jens

Classifications

• H10W90/00

  Package configurations · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• H01S5/02476

  Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · CPC title

• H01S5/02469 Primary

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/423

  having a vertical cavity · CPC title