Integrated parallel optical transceiver

Patent metadata

Field	Value
Publication number	US-2016226591-A1
Application number	US-201514614052-A
Country	US
Kind code	A1
Filing date	Feb 4, 2015
Priority date	Feb 4, 2015
Publication date	Aug 4, 2016
Grant date	—

Abstract

Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.

First claim

1 .- 16 . (canceled)

17 . An optical transceiver comprising:
a carrier having two opposing surfaces and one or more openings extending from a first surface of the two opposing surfaces to a second surface of the two opposing surfaces; a component having two opposing surfaces and one or more openings extending from a first surface of the two opposing surfaces to a second surface of the two opposing surfaces, wherein the component integrates a laser driver chip and a receiver amplifier chip, and wherein the component is coupled to the first surface of the carrier; a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface of the component; a photodetector array chip coupled to the first surface of the component; and an optical coupling element coupled to the second surface of the carrier; wherein the VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the component and the one or more openings in the carrier.

18 . The optical transceiver of claim 17 , further comprising a heat spreader/stiffener coupled via one or more intermediary components to at least a portion of the component, the VCSEL array chip, and the photodetector array chip.

19 . The optical transceiver of claim 17 , further comprising a plurality of electrical contact pads coupled to the second surface of the carrier, and wherein one or more of the plurality of electrical contact pads surround the optical coupling element.

20 . The optical transceiver of claim 17 , wherein the optical coupling element includes one or more of: a plurality of sampling lenses, a plurality of collimating lenses, at least one feedback mirror, a plurality of monitor focusing lenses, a plurality of final receiver focusing lenses, and a plurality of focusing lenses.

Assignees

• IBM

Inventors

• Arvelo Amilcar
• Benner Alan F
• Ellsworth Michael J
• Mckeever Eric J
• Nguyen Thong N
• Seminaro Edward J

Classifications

• H04B10/40 Primary

  Transceivers · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/4296

  coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources · CPC title

• G02B6/4272

  with mounting substrates of high thermal conductivity · CPC title