Semiconductor laser device and manufacturing method thereof, and submount manufacturing method

Patent metadata

Field	Value
Publication number	US-2016181760-A1
Application number	US-201615057770-A
Country	US
Kind code	A1
Filing date	Mar 1, 2016
Priority date	Apr 27, 2013
Publication date	Jun 23, 2016
Grant date	—

Abstract

A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.

First claim

What is claimed is:

1 . A method of manufacturing a submount, said method comprising:
applying a fluid object including an insulating member to one surface of a single crystal SiC having micropipes; sucking the applied fluid object from another surface of the single crystal SiC; and hardening the sucked fluid object in the micropipes to obtain the hardened fluid object as an insulating member.

2 . The method of manufacturing a submount according to claim 1 , wherein a part of the sucked fluid object is volatilized by the hardening and gaps are provided in the micropipes.

3 . The method of manufacturing a submount according to claim 1 , wherein at least a part of the insulating member formed on the one surface or the another surface of the single crystal SiC is removed, and an area in which the insulating member is not formed is provided on the one surface or the another surface of the single crystal SiC.

4 . The method of manufacturing a submount according to claim 1 , wherein all of the insulating member formed on the one surface and the another surface of the single crystal SiC is removed, and an area in which the insulating member is not formed is provided on each of the one surface and the another surface of the single crystal SiC.

5 . The method of manufacturing a submount according to claim 3 , wherein the insulating member is removed using a solution or abrasive grains which remove the insulating member at a speed that is greater than a speed at which the solution or abrasive grains remove the single crystal SiC.

6 . A method of manufacturing a semiconductor laser device using a submount manufactured by the manufacturing method according to claim 1 , wherein
a conductive base is fixed to a side of one of the one surface and the another surface of the single crystal SiC, and wherein a semiconductor laser element is provided on a side of the other of the one surface and the other surface of the single crystal SiC.

7 . The method of manufacturing a semiconductor laser device according to claim 6 , wherein the insulating member is formed on the surface where the semiconductor laser element is provided and on the surface fixed to a conductive base, and
an amount of the insulating member on the surface where the semiconductor laser element is provided is smaller than an amount of the insulating member on the surface fixed to a conductive base.

8 . The method of manufacturing a submount according to claim 4 , wherein the insulating member is removed using a solution or abrasive grains which remove the insulating member at a speed that is greater than a speed at which the solution or abrasive grains remove the single crystal SiC.

Assignees

• Nichia Corp

Inventors

• Sakata Hiroki
• Yuto Hiroaki
• Okahisa Eiichiro
• Kozuru Kazuma

Classifications

• H01S5/02469 Primary

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/02256

  Electricity · mapped topic

• H01S5/02476 Primary

  Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · CPC title

• H01S5/0233

  Mounting configuration of laser chips · CPC title

• H01S5/023

  Mount members, e.g. sub-mount members · CPC title