Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity

Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01S5/02461
Official title{Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity}
Display labelStructure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity
Total patents348

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201523
201628
201723
201826
201932
202030
202141
202239
202334
202433
202528
202611

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01S5/02461?
CPC H01S5/02461 is the Cooperative Patent Classification code for “Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity.”
How many patents are filed under CPC H01S5/02461 (Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity)?
Our database includes 348 publications tagged with this CPC code.
Is patent activity under CPC H01S5/02461 growing?
Publication counts under this code: 33 in 2024 vs 28 in 2025 (latest complete years).