Surface-emitting laser with multilayer thermally conductive mirror
US-2024106199-A1 · Mar 28, 2024 · US
Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01S5/02461 |
| Official title | {Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity} |
| Display label | Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity |
| Total patents | 348 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 23 |
| 2016 | 28 |
| 2017 | 23 |
| 2018 | 26 |
| 2019 | 32 |
| 2020 | 30 |
| 2021 | 41 |
| 2022 | 39 |
| 2023 | 34 |
| 2024 | 33 |
| 2025 | 28 |
| 2026 | 11 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024106199-A1 · Mar 28, 2024 · US
US-2017338625-A1 · Nov 23, 2017 · US
US-9787053-B2 · Oct 10, 2017 · US
US-9774168-B2 · Sep 26, 2017 · US
US-9705288-B2 · Jul 11, 2017 · US
US-2017195055-A1 · Jul 6, 2017 · US
US-9673590-B2 · Jun 6, 2017 · US
US-9667029-B2 · May 30, 2017 · US
US-2017117911-A1 · Apr 27, 2017 · US
US-9509122-B1 · Nov 29, 2016 · US
US-9484711-B2 · Nov 1, 2016 · US
US-2016315446-A1 · Oct 27, 2016 · US
US-2016315443-A1 · Oct 27, 2016 · US
US-2016315444-A1 · Oct 27, 2016 · US
US-2016294159-A1 · Oct 6, 2016 · US
US-2016294160-A1 · Oct 6, 2016 · US
US-2016276806-A1 · Sep 22, 2016 · US
US-2016276808-A1 · Sep 22, 2016 · US
US-2016254639-A1 · Sep 1, 2016 · US
US-9413135-B2 · Aug 9, 2016 · US
Answers are generated from the same data shown on this page.