Chip package unit with outer protective layer and method of manufactuirng the same
US-2024266239-A1 · Aug 8, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/498 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 713 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 62 |
| 2016 | 86 |
| 2017 | 99 |
| 2018 | 89 |
| 2019 | 79 |
| 2020 | 86 |
| 2021 | 54 |
| 2022 | 43 |
| 2023 | 28 |
| 2024 | 33 |
| 2025 | 43 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and method for producing the same
US-9224665-B2 · Dec 29, 2015 · US
Semiconductor device and method of manufacturing the same
US-2015371993-A1 · Dec 24, 2015 · US
Package on package structures and methods for forming the same
US-9219030-B2 · Dec 22, 2015 · US
Gallium arsenide devices with copper backside for direct die solder attach
US-2015364411-A1 · Dec 17, 2015 · US
Pad design for reliability enhancement in packages
US-2015364404-A1 · Dec 17, 2015 · US
Package-on-package with via on pad connections
US-9214450-B2 · Dec 15, 2015 · US
Design of a heat dissipation structure for an integrated circuit (ic) chip
US-2015357260-A1 · Dec 10, 2015 · US
Enforcement of semiconductor structure regularity for localized transistors and interconnect
US-9202779-B2 · Dec 1, 2015 · US
Three dimensional semiconductor device including pads
US-9202780-B2 · Dec 1, 2015 · US
Wiring board, wiring board with lead, and electronic device
US-2015334834-A1 · Nov 19, 2015 · US
Package structure, chip structure and fabrication method thereof
US-2015325545-A1 · Nov 12, 2015 · US
Semiconductor package and wiring board having the semiconductor package thereon
US-9184146-B2 · Nov 10, 2015 · US
Semiconductor package and method for fabricating base for semiconductor package
US-9177899-B2 · Nov 3, 2015 · US
Package structure and the method to manufacture thereof
US-9171818-B2 · Oct 27, 2015 · US
Integrated circuit with recess for die attachment
US-9171786-B1 · Oct 27, 2015 · US
Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
US-9165874-B2 · Oct 20, 2015 · US
Semiconductor device with air gap spacer and capping barrier layer and method for fabricating the same
US-9159609-B2 · Oct 13, 2015 · US
Ultra fine pitch and spacing interconnects for substrate
US-9159670-B2 · Oct 13, 2015 · US
Connection carrier for semiconductor chips and semiconductor component
US-9159658-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/498?
- CPC H01L23/498 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/498 (Electricity)?
- Our database includes 713 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/498 growing?
- Publication counts under this code: 33 in 2024 vs 43 in 2025 (latest complete years).