Wiring board, wiring board with lead, and electronic device

Patent metadata

Field	Value
Publication number	US-2015334834-A1
Application number	US-201414758390-A
Country	US
Kind code	A1
Filing date	Jul 28, 2014
Priority date	Jul 29, 2013
Publication date	Nov 19, 2015
Grant date	—

Abstract

A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.

First claim

1 . A wiring board, comprising:
an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate, the connection pad including a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion, and the second portion of the connection pad being composed of platinum, and at least an exposed surface part of the first portion of the connection pad being composed of platinum containing a ceramic component.

2 . The wiring board according to claim 1 , wherein an entirety of the surface part of the first portion is composed of the platinum containing the ceramic component.

3 . The wiring board according to claim 1 , wherein an entirety of the first portion is composed of the platinum containing the ceramic component.

4 . The wiring board according to claim 1 , wherein at least a part in a thickness direction of the first portion is buried in the insulating substrate.

5 . The wiring board according to claim 1 , wherein
an entirety of the first portion is composed of the platinum containing the ceramic component, and the second portion is located in a center portion of the first portion.

6 . The wiring board according to claim 5 , wherein the second portion includes a plurality of metal layers laminated on top of each other.

7 . The wiring board according to claim 1 , wherein
at least a part of the second portion protrudes upwardly from the first portion.

8 . The wiring board according to claim 1 , further comprising a conductor provided from a lower end of the connection pad toward an inside of the insulating substrate, wherein
at least an upper end portion of the conductor which is connected to the lower end of the connection pad is composed of a metallic material containing an iron-nickel-chrome alloy as a main component.

9 . The wiring board according to claim 8 , wherein an entirety of the conductor is composed of the metallic material containing the iron-nickel-chrome alloy as a main component.

10 . The wiring board according to claim 9 , wherein the metallic material further contains at least one of titanium, aluminum, molybdenum, copper, nitrogen, and silicon.

11 . A wiring board with a lead terminal, comprising:
the wiring board according to claim 1 ; and a lead terminal joined to the connection pad of the wiring board.

12 . The wiring board with a lead terminal according to claim 11 , wherein the lead terminal is joined to the connection pad by using a hard soldering material.

13 . The wiring board with a lead terminal according to claim 12 , wherein the hard soldering material spreads over the second portion alone in the connection pad.

14 . The wiring board with a lead terminal according to claim 12 , wherein the hard soldering material is composed of gold.

15 . An electronic device, comprising:
the wiring board according to claim 1 ; and an electronic component mounted on the insulating substrate and electrically connected to the connection pad.

Assignees

• Kyocera Corp

Inventors

• Otomaru Hidekazu
• Kimura Takashi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/692 Primary

  Ceramics or glasses · CPC title

• H10W70/66

  Conductive materials thereof · CPC title