Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2225/107 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 392 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 30 |
| 2017 | 32 |
| 2018 | 40 |
| 2019 | 40 |
| 2020 | 39 |
| 2021 | 24 |
| 2022 | 32 |
| 2023 | 37 |
| 2024 | 45 |
| 2025 | 40 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package using a coreless signal distribution structure
US-11869879-B2 · Jan 9, 2024 · US
Porous alumina templates for electronic packages
US-9615451-B2 · Apr 4, 2017 · US
Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer
US-9520387-B2 · Dec 13, 2016 · US
Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis
US-9515053-B2 · Dec 6, 2016 · US
Semiconductor package and method of manufacturing the semiconductor package
US-9515057-B2 · Dec 6, 2016 · US
Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same
US-9508704-B2 · Nov 29, 2016 · US
Semiconductor TSV device package for circuit board connection
US-9508690-B2 · Nov 29, 2016 · US
BVA interposer
US-9502390-B2 · Nov 22, 2016 · US
Semiconductor device and manufacturing method thereof
US-9484331-B2 · Nov 1, 2016 · US
Packaging for eight-socket one-hop SMP topology
US-9456506-B2 · Sep 27, 2016 · US
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
US-9449943-B2 · Sep 20, 2016 · US
Packaging for eight-socket one-hop SMP topology
US-9445507-B2 · Sep 13, 2016 · US
Z-connection for a microelectronic package using electroless plating
US-9443837-B2 · Sep 13, 2016 · US
Stacked microelectronic assemblies
US-9437582-B2 · Sep 6, 2016 · US
Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
US-9431331-B2 · Aug 30, 2016 · US
Stub minimization for multi-die wirebond assemblies with parallel windows
US-9423824-B2 · Aug 23, 2016 · US
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
US-9406641-B2 · Aug 2, 2016 · US
Combined substrate
US-9401320-B2 · Jul 26, 2016 · US
Stub minimization for assemblies without wirebonds to package substrate
US-9373565-B2 · Jun 21, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2225/107?
- CPC H01L2225/107 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2225/107 (Electricity)?
- Our database includes 392 publications tagged with this CPC code.
- Is patent activity under CPC H01L2225/107 growing?
- Publication counts under this code: 45 in 2024 vs 40 in 2025 (latest complete years).