Stackable molded microelectronic packages
US-9123664-B2 · Sep 1, 2015 · US
BVA interposer
US9502390B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502390-B2 |
| Application number | US-201313795756-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2013 |
| Priority date | Aug 3, 2012 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.
First claim
Opening claim text (preview).
The invention claimed is: 1. An interposer, comprising: a dielectric encapsulation having first and second oppositely-facing surfaces at which electrical connection can be made to respective first and second external components; and a plurality of wire bonds each separated from one another by the encapsulation, each wire bond having first and second opposite extremities not fully covered by the encapsulation at the first and second surfaces, respectively, and an edge surface bet…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9502390B2 cover?
- A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second oppos…
- Who is the assignee on this patent?
- Invensas Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/635. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).