Integrated circuit with a sidewall layer and an ultra-thick metal layer and method of making
US-9502346-B2 · Nov 22, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/76808 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 398 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 35 |
| 2017 | 39 |
| 2018 | 43 |
| 2019 | 55 |
| 2020 | 63 |
| 2021 | 45 |
| 2022 | 26 |
| 2023 | 26 |
| 2024 | 21 |
| 2025 | 16 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor magnetic memory device and method for manufacturing the same
US-9502291-B2 · Nov 22, 2016 · US
Patternable dielectric film structure with improved lithography and method of fabricating same
US-9484248-B2 · Nov 1, 2016 · US
Method for producing self-aligned vias
US-9484258-B1 · Nov 1, 2016 · US
Interconnect arrangement with stress-reducing structure and method of fabricating the same
US-9472508-B2 · Oct 18, 2016 · US
Dielectric constant recovery
US-2016300757-A1 · Oct 13, 2016 · US
Semiconductor device with air gap and method for fabricating the same
US-9466603-B2 · Oct 11, 2016 · US
Metallization method for semiconductor structures
US-9437488-B2 · Sep 6, 2016 · US
Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating same
US-9431295-B2 · Aug 30, 2016 · US
Alternate dual damascene method for forming interconnects
US-9431292-B1 · Aug 30, 2016 · US
Semiconductor device having jumper pattern and blocking pattern
US-9412693-B2 · Aug 9, 2016 · US
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects
US-9406512-B2 · Aug 2, 2016 · US
Etch damage and esl free dual damascene metal interconnect
US-2016211174-A1 · Jul 21, 2016 · US
Opposite polarity borderless replacement metal contact scheme
US-9390979-B2 · Jul 12, 2016 · US
Semiconductor device and a method of manufacturing the same
US-9391022-B2 · Jul 12, 2016 · US
Interconnect structures incorporating air-gap spacers
US-2016197002-A1 · Jul 7, 2016 · US
Bi-layer hard mask for robust metallization profile
US-9385086-B2 · Jul 5, 2016 · US
Semiconductor structures and methods of manufacturing the same
US-9379003-B2 · Jun 28, 2016 · US
Gap fill treatment for via process
US-9368396-B1 · Jun 14, 2016 · US
Method for preventing extreme low-K (ELK) dielectric layer from being damaged during plasma process
US-9355893-B1 · May 31, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/76808?
- CPC H01L21/76808 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/76808 (Electricity)?
- Our database includes 398 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/76808 growing?
- Publication counts under this code: 21 in 2024 vs 16 in 2025 (latest complete years).