Substrate carrier for a reduced transmission of thermal energy

Patent metadata

Field	Value
Publication number	US-2016276142-A1
Application number	US-201315031138-A
Country	US
Kind code	A1
Filing date	Nov 25, 2013
Priority date	Nov 25, 2013
Publication date	Sep 22, 2016
Grant date	—

Abstract

According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

First claim

1 . A substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device, the substrate carrier comprising:
a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion, wherein the at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

2 . The substrate carrier of claim 1 , further comprising at least one second intermediate portion located between the main portion and a second end portion adapted to be supported by the transport device.

3 . The substrate carrier according to claim 1 , wherein the length of the shortest thermally conducting path between the main portion and the first end portion is greater than the shortest distance between the main portion and the first end portion.

4 . The substrate carrier according to claim 1 , wherein every straight path from the main portion to the first end portion crosses at least one of the one or more cut-outs.

5 . The substrate carrier according to claim 1 , wherein at least one of the one or more cut-outs is completely surrounded by the substrate carrier.

6 . The substrate carrier according to claim 1 , wherein at least one of the one or more cut-outs is arranged such that the total length of an outer side edge of the at least one first intermediate portion is greater than the length of a straight line parallel to an outer side edge of the substrate carrier, along the outer side edge of the first intermediate portion.

7 . The substrate carrier according to claim 1 , wherein the at least one first intermediate portion comprises two or more cut-outs.

8 . The substrate carrier according to claim 1 , wherein the at least one first intermediate portion comprises one or more stress reducing cut-outs.

9 . The substrate carrier according to claim 8 , wherein the one or more stress reducing cut-outs are part of the one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

10 . The substrate carrier according to claim 8 , wherein the one or more stress reducing cut-outs have a radius of curvature greater than 2 mm.

11 . The substrate carrier according to claim 1 , wherein the one or more cut-outs extend completely through the substrate carrier.

12 . The substrate carrier according to claim 2 , wherein the first end portion and the second end portion are at opposite ends of the substrate carrier.

13 . Use of the substrate carrier according to claim 1 for reducing the thermal energy transfer between the substrate and the transport device whilst the substrate held by the substrate carrier is undergoing thermal processing.

14 . A system for processing a substrate comprising:
a substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device, the substrate carrier comprising:
a main portion for holding the substrate;
a first end portion adapted to be supported by the transport device; and
at least one first intermediate portion connecting the main portion with the first end portion, wherein the at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion;
at least one processing chamber for processing the substrate; and a transport device for supporting the substrate carrier.

15 . The system of claim 14 , wherein the system is a vacuum deposition system.

16 . The substrate carrier according to claim 2 , wherein the at least one second intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the second end portion.

17 . The substrate carrier according to claim 2 , wherein every straight path from the main portion to the first end portion and from the main portion to the second end portion crosses at least one of the one or more cut-outs.

18 . The substrate carrier according to claim 2 , wherein the at least one first intermediate portion and the at least one second intermediate portion comprise two or more cut-outs.

19 . The substrate carrier according to claim 2 , wherein the at least one first intermediate portion and the at least one second intermediate portion comprise one or more stress reducing cut-outs.

20 . The substrate carrier according to claim 11 , wherein the one or more stress reducing cut-outs extend completely through the substrate carrier.

Assignees

• Applied Materials Inc

Inventors

• Lopp Andreas Ewald
• Keller Stefan
• Schüßler Uwe
• Bangert Stefan
• Gebele Thomas
• Spatz Norbert

Classifications

• H10P72/135

  characterised by a material, a roughness, a coating or the like · CPC title

• H10P72/18 Primary

  characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports · CPC title

• H10F71/1395

  for thin-film devices · CPC title

• H10F71/137

  Batch treatment of the devices · CPC title

• H01J37/32724 Primary

  Temperature · CPC title