Isotope Capacitor
US-2026038705-A1 · Feb 5, 2026 · US
This page is not indexed by search engines while we improve data quality.
obtained from a another capacitor
obtained from a another capacitor · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G4/304 |
| Official title | {obtained from a another capacitor} |
| Display label | obtained from a another capacitor |
| Total patents | 15 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 2 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 1 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multilayer capacitor
US-12094660-B2 · Sep 17, 2024 · US
Multilayer capacitor
US-2023129081-A1 · Apr 27, 2023 · US
Methods for making three-dimensional module
US-11616030-B2 · Mar 28, 2023 · US
Methods for Making Three-Dimensional Module
US-2022084961-A1 · Mar 17, 2022 · US
Three-dimensional module with integrated passive components
US-11217542-B2 · Jan 4, 2022 · US
Three-Dimensional Module with Integrated Passive Components
US-2021013162-A1 · Jan 14, 2021 · US
Method for producing ceramic multi-layer components
US-10784435-B2 · Sep 22, 2020 · US
Capacitor Array with Staggered Layer Structure for Millimeter Wave Frequency Band
US-2020219655-A1 · Jul 9, 2020 · US
Multilayer electronic component
US-10403433-B2 · Sep 3, 2019 · US
Multilayer electronic component
US-2018122578-A1 · May 3, 2018 · US
Manufacturing method for laminated electronic component
US-9922765-B2 · Mar 20, 2018 · US
Method for producing ceramic multi-layer components and ceramic multi-layer component
US-2017222120-A1 · Aug 3, 2017 · US
Dielectric and/or capacitor formation
US-9230797-B2 · Jan 5, 2016 · US
Laminated electronic component manufacturing method, and laminated electronic component
US-2015116900-A1 · Apr 30, 2015 · US