Inductor and coil substrate

Patent metadata

Field	Value
Publication number	US-9406432-B2
Application number	US-201514706164-A
Country	US
Kind code	B2
Filing date	May 7, 2015
Priority date	May 22, 2014
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.

First claim

The invnetion claimed is:

1. An inductor comprising:
a stacked body;
a first through hole that extends through the stacked body in a thickness direction; and
an insulation film that covers a surface of the stacked body, wherein the stacked body includes:
a first wiring;
a first insulation layer stacked on an upper surface of the first wiring, wherein the first insulation layer includes a second through hole exposing a portion of the upper surface of the first wiring;
a first adhesive layer stacked on an upper surface of the first insulation layer, wherein the first adhesive layer includes a third through hole communicating with the second through hole;
a second wiring stacked on an upper surface of the first adhesive layer, wherein the second wiring includes a fourth through hole communicating with the third through hole;
a second insulation layer stacked on an upper surface of the second wiring, wherein the second insulation layer includes a fifth through hole, which communicates with the fourth through hole, and a sixth through hole, which exposes a portion of the upper surface of the second wiring; and
a first through electrode, wherein the second through hole, the third through hole, the fourth through hole, and the fifth through hole are filled with the first through electrode; wherein:
the first wiring and the second wiring are connected in series to form a helical coil; and
the fifth through hole has a larger planar shape than the fourth through hole.

2. The inductor according to claim 1 , wherein:
the second through hole has a larger planar shape than the third through hole;
the first adhesive layer covers a portion of a side surface of the second wiring and covers an inner side surface of the second through hole; and
the third through hole is partially formed in the second through hole.

3. The inductor according to claim 1 , wherein:
the first insulation layer further includes a seventh through hole;
the first wiring includes an eighth through hole; and
the stacked body further includes
a second adhesive layer stacked on a lower surface of the first wiring, wherein the second adhesive layer includes a ninth through hole communicating with the seventh through hole and the eighth through hole, and
a second through electrode, wherein the seventh through hole, the eighth through hole, and the ninth through hole are filled with the second through electrode;
wherein the second through electrode includes a lower end face exposed from a lower surface of the second adhesive layer.

4. The inductor according to claim 1 , wherein
the stacked body further includes:
a second adhesive layer stacked on a lower surface of the first wiring;
a substrate stacked on a lower surface of the second adhesive layer;
a third insulation layer stacked on a lower surface of the substrate; and
a third wiring stacked on a lower surface of the third insulation layer and located in a lowermost layer of the stacked body; wherein:
the third wiring, the first wiring, and the second wiring are connected in series to form the helical coil; and
the substrate is thicker than each of the first insulation layer, the second insulation layer, and the third insulation layer.

5. The inductor according to claim 1 , wherein
the stacked body further includes:
a third adhesive layer stacked on an upper surface of the second insulation layer, wherein the third adhesive layer includes a tenth through hole communicating with the sixth through hole;
a fourth wiring stacked on an upper surface of the third adhesive layer, wherein the fourth wiring includes an eleventh through hole communicating with the tenth through hole;
a fourth insulation layer that includes a twelfth through hole communicating with the eleventh through hole; and
a third through electrode, wherein the sixth through hole, the tenth through hole, the eleventh through hole, and the twelfth through hole are filled with the third through electrode; wherein:
the twelfth through hole has a larger planar shape than the eleventh through hole;
the sixth through hole has a larger planar shape than the tenth through hole;
the third adhesive layer covers a portion of a side surface of the fourth wiring and covers an inner side surface of the sixth through hole; and
the tenth through hole is partially formed in the sixth through hole.

6. The inductor according to claim 1 , wherein:
the helical coil includes two connecting portions respectively arranged on two ends of the helical coil;
the insulation film covers a side surface of the first wiring and a side surface of the second wiring, which are exposed from an inner wall surface of the first through hole;
the connecting portions are exposed from the insulation film; and
the inductor further comprises:
an encapsulation resin that covers the stacked body and the insulation film excluding the connecting portions, wherein the first through hole is filled with the encapsulation resin; and
two electrodes that cover the encapsulation resin, wherein the two electrodes are electrically connected to the two connecting portions, respectively;
wherein the encapsulation resin contains a magnetic body.

7. A coil substrate comprising:
a block including a plurality of unit coil substrates formed in a plurality of regions, wherein each of the unit coil substrates includes:
a stacked body;
a first through hole that extends through the stacked body in a thickness direction; and
an insulation film that covers a surface of the stacked body, wherein the stacked body includes:
a first wiring;
a first insulation layer stacked on an upper surface of the first wiring, wherein the first insulation layer includes a second through hole exposing a portion of the upper surface of the first wiring;
a first adhesive layer stacked on an upper surface of the first insulation layer, wherein the first adhesive layer includes a third through hole communicating with the second through hole;
a second wiring stacked on an upper surface of the first adhesive layer, wherein the second wiring includes a fourth through hole communicating with the third through hole;
a second insulation layer stacked on an upper surface of the second wiring, wherein the second insulation layer includes a fifth through hole, which communicates with the fourth through hole, and a sixth through hole, which exposes a portion of the upper surface of the second wiring; and
a first through electrode, wherein the second through hole, the third through hole, the fourth through hole, and the fifth through hole are filled with the first through electrode; wherein:
the first wiring and the second wiring are connected in series to form a helical coil; and
the fifth through hole has a larger planar shape than the fourth through hole.

8. The coil substrate according to claim 7 , wherein the stacked body further includes;
a second adhesive layer stacked on a lower surface of the first wiring;
a substrate stacked on a lower surface of the second adhesive layer;
a third insulation layer stacked on a lower surface of the substrate; and
a third wiring stacked on a lower surface of the third insulation layer and located in a lowermost layer of the stacked body; wherein:
the coil substrate further comprises an outer frame formed by the substrate and extending toward an outer side from the block; and
the outer frame includes a through hole used for conveying or positioning the coil substrate.

Assignees

• Shinko Electric Ind Co
• Shinko Electric Ind Co

Inventors

• Nakamura Atsushi
• Nakanishi Tsukasa
• Sato Kiyokazu

Classifications

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F2017/002

  Details of via holes for interconnecting the layers · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F27/24

  Magnetic cores · CPC title

• H01F2027/2809

  on stacked layers · CPC title