Thin film structure for micro-bolometer and method for fabricating the same
US-10488263-B2 · Nov 26, 2019 · US
by sputtering · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C17/12 |
| Official title | by sputtering |
| Display label | by sputtering |
| Total patents | 89 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 12 |
| 2017 | 8 |
| 2018 | 17 |
| 2019 | 15 |
| 2020 | 6 |
| 2021 | 7 |
| 2022 | 2 |
| 2023 | 9 |
| 2024 | 3 |
| 2026 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-10488263-B2 · Nov 26, 2019 · US
US-10453617-B2 · Oct 22, 2019 · US
US-2019316968-A1 · Oct 17, 2019 · US
US-10446295-B2 · Oct 15, 2019 · US
US-2019295948-A1 · Sep 26, 2019 · US
US-2019228887-A1 · Jul 25, 2019 · US
US-2019221516-A1 · Jul 18, 2019 · US
US-10354951-B1 · Jul 16, 2019 · US
US-2019204162-A1 · Jul 4, 2019 · US
US-10304597-B2 · May 28, 2019 · US
US-10299383-B2 · May 21, 2019 · US
US-2019051463-A1 · Feb 14, 2019 · US
US-2019035520-A1 · Jan 31, 2019 · US
US-10186381-B2 · Jan 22, 2019 · US
US-10170224-B2 · Jan 1, 2019 · US
US-10134529-B2 · Nov 20, 2018 · US
US-2018321091-A1 · Nov 8, 2018 · US
US-10113919-B2 · Oct 30, 2018 · US
US-10115504-B2 · Oct 30, 2018 · US
US-2018306646-A1 · Oct 25, 2018 · US
Answers are generated from the same data shown on this page.