Composite electronic component and resistance element

Patent metadata

Field	Value
Publication number	US-10186381-B2
Application number	US-201615205124-A
Country	US
Kind code	B2
Filing date	Jul 8, 2016
Priority date	Jul 10, 2015
Publication date	Jan 22, 2019
Grant date	Jan 22, 2019

Abstract

A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, a protective film and first and second upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction and the resistor is between the first and second upper surface conductors. The protective film covers the resistor. Dimensions in the height direction from the upper surface of the base portion to exposed surfaces of a pair of end portions in the length direction of the protective film are smaller than a dimension in the height direction from the upper surface of the base portion to an exposed surface of the protective film in the center portion.

First claim

What is claimed is:

1. A composite electronic component comprising:
a resistance element; and
an electronic element mounted on the resistance element in a height direction; wherein
the resistance element includes:
an insulating base portion including an upper surface and a lower surface intersecting the height direction;
a first upper surface conductor and a second upper surface conductor that are disposed on the upper surface of the base portion and are separated from each other in a length direction perpendicular or substantially perpendicular to the height direction;
a resistor that is disposed on the upper surface of the base portion and is located between the first upper surface conductor and the second upper surface conductor; and
a protective film that covers the resistor and at least a portion of the upper surface of the base portion;

the electronic element includes:
an electronic element body including a lower surface intersecting the height direction; and
a first external electrode and a second external electrode that are disposed at least on the lower surface of the electronic element body and are separated from each other in the length direction; wherein
the upper surface of the base portion and the lower surface of the electronic element body face each other in the height direction;
the first upper surface conductor and the first external electrode are electrically connected;
the second upper surface conductor and the second external electrode are electrically connected; and
a dimension in the height direction from the upper surface of the base portion to an exposed surface of a pair of end portions of the protective film is smaller than a dimension in the height direction from the upper surface of the base portion to an exposed surface of a center portion of the protective film.

2. The composite electronic component according to claim 1 , wherein the dimension in the height direction from the upper surface of the base portion to the exposed surface of the pair of end portions of the protective film decreases as a distance along the length direction from the center portion of the protective film increases.

3. The composite electronic component according to claim 1 , wherein the resistor does not overlap the first external electrode and the second external electrode in the height direction.

4. The composite electronic component according to claim 1 , wherein the resistance element further includes:
a first lower surface conductor and a second lower surface conductor that are disposed on the lower surface of the base portion and are separated from each other in the length direction;
a first connecting conductor that connects the first upper surface conductor and the first lower surface conductor; and
a second connecting conductor that connects the second upper surface conductor and the second lower surface conductor.

5. The composite electronic component according to claim 4 , wherein the resistance element further includes:
a third upper surface conductor and a fourth upper surface conductor that are disposed on the upper surface of the base portion, are separated from each other, and are located between the first upper surface conductor and the second upper surface conductor;
a third lower surface conductor and a fourth lower surface conductor that are disposed on the lower surface of the base portion, are separated from each other, and are located between the first lower surface conductor and the second lower surface conductor;
a third connecting conductor that connects the third upper surface conductor and the third lower surface conductor; and
a fourth connecting conductor that connects the fourth upper surface conductor and the fourth lower surface conductor; and
the third upper surface conductor and the fourth upper surface conductor are connected with the resistor.

6. The composite electronic component according to claim 5 , wherein the third upper surface conductor and the fourth upper surface conductor are separated from each other in a width direction perpendicular or substantially perpendicular to the height direction and the length direction.

7. The composite electronic component according to claim 5 , wherein the third upper surface conductor and the fourth upper surface conductor are separated from each other in the length direction.

8. The composite electronic component according to claim 7 , wherein at least one of the third connecting conductor and the fourth connecting conductor includes:
an internal connecting conductor extending in a direction perpendicular or substantially perpendicular to the height direction inside the base portion;
an upper via conductor extending in the height direction that is connected with the internal connecting conductor and is located between the upper surface of the base portion and the internal connecting conductor; and
a lower via conductor extending in the height direction that is connected with the internal connecting conductor and is located between the lower surface of the base portion and the internal connecting conductor; wherein
the lower via conductor does not overlap the upper via conductor at least partly in the height direction.

9. The composite electronic component according to claim 4 , wherein the resistance element further includes:
a third upper surface conductor that is disposed on the upper surface of the base portion, and is located between the first upper surface conductor and the second upper surface conductor;
a third lower surface conductor that is disposed on the lower surface of the base portion, and is located between the first lower surface conductor and the second lower surface conductor; and
a third connecting conductor that connects the third upper surface conductor and the third lower surface conductor; wherein
the first upper surface conductor and the third upper surface conductor are connected with the resistor.

10. The composite electronic component according to claim 9 , wherein the third connecting conductor includes:
an internal connecting conductor extending in a direction perpendicular or substantially perpendicular to the height direction inside the base portion;
an upper via conductor extending in the height direction, that is connected with the internal connecting conductor and is located between the upper surface of the base portion and the internal connecting conductor; and
a lower via conductor extending in the height direction, that is connected with the internal connecting conductor and is located between the lower surface of the base portion and the internal connecting conductor; wherein
the lower via conductor does not overlap the upper via conductor at least partly in the height direction.

11. A resistance element comprising:
an insulating base portion including an upper surface and a lower surface that are opposite to each other in a height direction;
a first upper surface conductor and a second upper surface conductor that are disposed on the upper surface of the base portion and are separated from each other in a length direction that is perpendicular or substantially perpendicular to the height direction;
a resistor that is disposed on the upper surface of the base portion and is located between the first upper surface conductor and the second upper surface conductor; and
a protective film that covers the resistor and at least a portion of the upper surface of the base portion; wherein
a dimension in the height direction from the upper surface of the base portion to an exposed surface of a pair of end portions of the protective film is smaller than a dimension in the height direction from the upper surface of the base portion to an

Assignees

• Murata Manufacturing Co

Inventors

• Hattori Kazuo
• Fujimoto Isamu
• Kuroiwa Shinichiro

Classifications

• H01G4/40 Primary

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01C7/006

  Thin film resistors · CPC title

• H01C7/00 Primary

  Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C8/00; resistors having potential barriers, e.g. field-effect resistors, H10D1/40 - H10D1/43, H10K10/10; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H10F30/00; magnetic field controlled resistors H10N50/10; bulk negative resistance effect devices H10N80/00) · CPC title

• H01C1/014

  the resistor being suspended between and being supported by two supporting sections (H01C1/016 takes precedence) · CPC title