Composite electronic component and resistance element

Patent metadata

Field	Value
Publication number	US-10134529-B2
Application number	US-201615205120-A
Country	US
Kind code	B2
Filing date	Jul 8, 2016
Priority date	Jul 10, 2015
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A composite electronic component includes an electronic element mounted on a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, and first and second upper surface conductors on the upper surface of the base portion. The first and second upper surface conductors are separated from each other in the length direction, and the resistor is located between the first and second upper surface conductors. A dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first external electrode of a portion located on a lower surface of the electronic element body, and a dimension in the height direction of the second external electrode of a portion located on a lower surface of the electronic element body.

First claim

What is claimed is:

1. A composite electronic component comprising:
a resistance element; and
an electronic element mounted on the resistance element in a height direction; wherein
the resistance element includes:
an insulating base portion including an upper surface and a lower surface intersecting with the height direction;
a first upper surface conductor and a second upper surface conductor that are disposed on the upper surface of the base portion and are separated from each other in a length direction perpendicular or substantially perpendicular to the height direction; and
a resistor that is disposed on the upper surface of the base portion and is located between the first upper surface conductor and the second upper surface conductor; wherein

the electronic element includes:
an electronic element body including a lower surface intersecting with the height direction; and
a first external electrode and a second external electrode that are disposed at least on the lower surface of the electronic element body and are separated from each other in the length direction; wherein
the upper surface of the base portion and the lower surface of the electronic element body face each other in the height direction;
the first upper surface conductor and the first external electrode are electrically connected;
the second upper surface conductor and the second external electrode are electrically connected;
a dimension in the height direction of the resistor is smaller than both a dimension in the height direction of a portion of the first external electrode, which is located on the lower surface of the electronic element body, and a dimension in the height direction of a portion of the second external electrode, which is located on the lower surface of the electronic element body.

2. The composite electronic component according to claim 1 , wherein the resistor is a thin film.

3. The composite electronic component according to claim 1 , wherein the resistor is a sputtered film.

4. The composite electronic component according to claims 1 , wherein the resistance element further includes:
a first lower surface conductor and a second lower surface conductor that are disposed on the lower surface of the base portion and are separated from each other in the length direction;
a first connecting conductor connecting the first upper surface conductor and the first lower surface conductor; and
a second connecting conductor connecting the second upper surface conductor and the second lower surface conductor.

5. The composite electronic component according to claim 4 , wherein the resistance element further includes:
a third upper surface conductor that is disposed on the upper surface of the base portion and is located between the first upper surface conductor and the second upper surface conductor;
a third lower surface conductor that is disposed on the lower surface of the base portion and is located between the first lower surface conductor and the second lower surface conductor; and
a third connecting conductor connecting the third upper surface conductor and the third lower surface conductor; and
the third upper surface conductor is connected with the resistor.

6. The composite electronic component according to claim 5 , wherein the third upper surface conductor includes a sputtered film.

7. The composite electronic component according to claim 5 , wherein the resistance element further includes:
a fourth upper surface conductor that is disposed on the upper surface of the base portion, and is located between the first upper surface conductor and the second upper surface conductor;
a fourth lower surface conductor that is disposed on the lower surface of the base portion, and is located between the first lower surface conductor and the second lower surface conductor; and
a fourth connecting conductor connecting the fourth upper surface conductor and the fourth lower surface conductor;
the fourth upper surface conductor is connected with the resistor; and
the third upper surface conductor and the fourth upper surface conductor are separated from each other in a width direction perpendicular or substantially perpendicular to the height direction and the length direction.

8. The composite electronic component according to claim 7 , wherein both the third upper surface conductor and the fourth upper surface conductor include a sputtered film.

9. The composite electronic component according to claim 5 , wherein the resistance element further includes:
a fourth upper surface conductor that is disposed on the upper surface of the base portion, and is located between the first upper surface conductor and the second upper surface conductor;
a fourth lower surface conductor that is disposed on the lower surface of the base portion, and is located between the first lower surface conductor and the second lower surface conductor; and
a fourth connecting conductor connecting the fourth upper surface conductor and the fourth lower surface conductor;
the fourth upper surface conductor is connected with the resistor; and
the third upper surface conductor and the fourth upper surface conductor are separated from each other in the length direction.

10. The composite electronic component according to claim 4 , wherein the resistance element further includes:
a third lower surface conductor that is disposed on the lower surface of the base portion, and is located between the first lower surface conductor and the second lower surface conductor; and
a third connecting conductor that connects with the third lower surface conductor and is exposed from the base portion in the upper surface of the base portion; and
the resistor covers a portion of the third connecting conductor exposed from the base portion, and is connected with the third connecting conductor.

11. The composite electronic component according to claim 10 , wherein the resistance element further includes:
a fourth lower surface conductor that is disposed on the lower surface of the base portion, and is located between the first lower surface conductor and the second lower surface conductor; and
a fourth connecting conductor that connects with the fourth lower surface conductor and is exposed from the base portion in the upper surface of the base portion; and
the resistor covers a portion of the fourth connecting conductor exposed from the base portion, and is connected with the fourth connecting conductor.

12. The composite electronic component according to claim 1 , wherein the resistance element further includes a protective film that covers the resistor.

13. The composite electronic component according to claim 1 , wherein the dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first upper surface conductor and a dimension in the height direction of the second upper surface conductor.

Assignees

• Murata Manufacturing Co

Inventors

• Hattori Kazuo
• Fujimoto Isamu
• Kuroiwa Shinichiro

Classifications

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C7/006

  Thin film resistors · CPC title

• H01C7/003

  Thick film resistors · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/40 Primary

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title